Inventor · disambiguated record
Hiroyuki Shiraki
Also filed as: SHIRAKI HIROYUKI
21 granted patents·2 pending applications·243 citations·filing 1984–2019
94Inventor score
Files withTAKEDA CHEMICAL INDUSTRIES LTD5MITSUBISHI MATERIAL SILICON4MITSUI TAKEDA CHEMICALS INC3PANASONIC IP MAN CO LTD2SIEMENS AG2
Top patents by PatentIndex Score
23 records- 0195US6569533B1Gas barrier polyurethane resinMITSUI TAKEDA CHEMICALS INC·Filed 2000·Granted May 27, 2003·85 cites·11 claims
- 0289US4507458AUrethane acrylate compositionsTAKEDA CHEMICAL INDUSTRIES LTD·Filed 1984·Granted Mar 26, 1985·54 cites·10 claims
- 0372US6547875B1Epitaxial wafer and a method for manufacturing the sameMITSUBISHI MATERIAL SILICON·Filed 2000·Granted Apr 15, 2003·18 cites·4 claims
- 0468US6693286B2Method for evaluating the quality of a semiconductor substrateMITSUBISHI MATERIAL SILICON·Filed 2002·Granted Feb 17, 2004·8 cites·2 claims
- 0568US6534774B2Method and apparatus for evaluating the quality of a semiconductor substrateMITSUBISHI MATERIAL SILICON·Filed 2001·Granted Mar 18, 2003·8 cites·4 claims
- 0665US6979493B2Gas barrier polyurethane resinMITSUI TAKEDA CHEMICAL INC·Filed 2003·Granted Dec 27, 2005·11 cites·11 claims
- 0760US6239215B1Powder coating compositionTAKEDA CHEMICAL INDUSTRIES LTD·Filed 1999·Granted May 29, 2001·19 cites·17 claims
- 0857US8026182B2Heat treatment jig and heat treatment method for silicon waferSUMCO CORP·Filed 2008·Granted Sep 27, 2011·0 cites·4 claims
- 0956US10347774B2Electrode provided with UBM structure having a barrier layer for reducing solder diffusion into the electrode and a method for producing the sameSIEMENS AG·Filed 2015·Granted Jul 9, 2019·1 cites·6 claims
- 1055US5401571AMagnetic recording media having a binder comprising a sulfobetaine containing polyurethane resinTAKEDA CHEMICAL INDUSTRIES LTD·Filed 1991·Granted Mar 28, 1995·9 cites·7 claims
- 1153US4898922AUrethane resinsTAKEDA CHEMICAL INDUSTRIES LTD·Filed 1988·Granted Feb 6, 1990·8 cites·5 claims
- 1252US6881788B2Polyurethane resin water dispersion and aqueous polyurethane adhesiveMITSUI TAKEDA CHEMICALS INC·Filed 2002·Granted Apr 19, 2005·4 cites·7 claims
- 1351US12021015B2Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substratePANASONIC IP MAN CO LTD·Filed 2019·Granted Jun 25, 2024·0 cites·7 claims
- 1451US6818197B2Epitaxial waferMITSUBISHI MATERIAL SILICON·Filed 2003·Granted Nov 16, 2004·4 cites·5 claims
- 1550US7481888B2Heat treatment jig and heat treatment method for silicon waferSUMCO CORP·Filed 2004·Granted Jan 27, 2009·2 cites·2 claims
- 1649US7670965B2Production method for silicon wafers and silicon waferSUMITOMO MITSUBISHI SILICON·Filed 2005·Granted Mar 2, 2010·0 cites·7 claims
- 1749US7521381B2Method for producing silicon wafer and silicon waferSUMITOMO MITSUBISHI SILICON·Filed 2001·Granted Apr 21, 2009·2 cites·6 claims
- 1848US9755098B2Radiation detector manufactured by dicing a semiconductor wafer and dicing method thereforSIEMENS AG·Filed 2014·Granted Sep 5, 2017·0 cites·6 claims
- 1947US2013161773A1Detector element, radiation detector, medical device, and method for producing such a detector elementDIERRE FABRICE·Filed 2012·Application pending·0 cites
- 2046US7026369B2Aqueous emulsion composition and adherent compositionMITSUI TAKEDA CHEMICALS INC·Filed 2002·Granted Apr 11, 2006·0 cites·9 claims
- 2144US6384633B1Semiconductor deviceFUJITSU LTD·Filed 2001·Granted May 7, 2002·1 cites·6 claims
- 2240US5866657APrimer compositionTAKEDA CHEMICAL INDUSTRIES LTD·Filed 1997·Granted Feb 2, 1999·9 cites·6 claims
- 2340US2016293538A1Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substratePANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →