Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substrate

Abstract

A thermosetting resin composition according to the invention contains: a thermosetting resin component; and silica having an average particle diameter equal to or greater than 0.2 μm and treated with isocyanate. It is preferable that the content of the silica is in a range of 50% by mass to 300% by mass with respect to the thermosetting resin component. It is also preferable that the thermosetting resin composition contains core shell rubber having content in a range of 20% by mass to 80% by mass with respect to the thermosetting resin component.

What is claimed is: 
     
         1 . A thermosetting resin composition comprising:
 a thermosetting resin component; and   silica having an average particle diameter equal to or greater than 0.2 μm and treated with isocyanate.   
     
     
         2 . The thermosetting resin composition according to  claim 1 ,
 wherein a content of the silica is in a range of 50% by mass to 300% by mass with respect to the thermosetting resin component.   
     
     
         3 . The thermosetting resin composition according to  claim 1 , further comprising:
 core shell rubber having a content in a range of 20% by mass to 80% by mass with respect to the thermosetting resin component.   
     
     
         4 . A metal-clad laminated plate comprising:
 an insulating layer containing a hardened material of the thermosetting resin composition according to  claim 1 ; and   a metal foil.   
     
     
         5 . An insulating sheet formed of an insulating layer containing a hardened material of the thermosetting resin composition according to  claim 1 . 
     
     
         6 . A printed wiring board comprising:
 an insulating layer containing a hardened material of the thermosetting resin composition according to  claim 1 ; and   conductive wirings.   
     
     
         7 . The printed wiring board according to  claim 6 , further comprising through holes. 
     
     
         8 . A method of manufacturing a printed wiring board, comprising:
 forming holes penetrating through the insulating layer in the metal-clad laminated plate according to  claim 4 ; and   performing a desmear treatment with respect to an inner wall of each of the holes.   
     
     
         9 . A method of manufacturing a printed wiring board, comprising:
 forming holes penetrating through the insulating layer in the insulating sheet according to  claim 5 ; and   performing a desmear treatment with respect to an inner wall of each of the holes.   
     
     
         10 . A package substrate comprising:
 the printed wiring board according to  claim 6 ; and   a semiconductor chip mounted on the printed wiring board.   
     
     
         11 . A package substrate comprising:
 the printed wiring board manufactured by the method according to  claim 8  and   a semiconductor chip mounted on the printed wiring board.