Inventor · disambiguated record
Minghao Shen
Also filed as: SHEN MINGHAO
24 granted patents·3 pending applications·108 citations·filing 2006–2021
94Inventor score
Files withSPANSION LLC10DIDREW TECH BVI LIMITED8ALTERA CORP5CHENGDU ESWIN SIP TECH CO LTD2CHENG NING1
Top patents by PatentIndex Score
27 records- 0193US10347509B1Molded cavity fanout package without using a carrier and method of manufacturing the sameDIDREW TECH BVI LIMITED·Filed 2018·Granted Jul 9, 2019·12 cites·14 claims
- 0293US10209542B1System and method of embedding driver IC (EmDIC) in LCD display substrateDIDREW TECH BVI LIMITED·Filed 2018·Granted Feb 19, 2019·7 cites·20 claims
- 0392US9806061B2Bumpless wafer level fan-out packageALTERA CORP·Filed 2016·Granted Oct 31, 2017·10 cites·20 claims
- 0491US9425125B2Silicon-glass hybrid interposer circuitryALTERA CORP·Filed 2014·Granted Aug 23, 2016·11 cites·20 claims
- 0590US12199025B2Interposer structure containing embedded silicon-less link chipletDIDREW TECH BVI LIMITED·Filed 2021·Granted Jan 14, 2025·2 cites·15 claims
- 0690US9385060B1Integrated circuit package with enhanced thermal conductionALTERA CORP·Filed 2014·Granted Jul 5, 2016·12 cites·11 claims
- 0790US7368347B2Dual bit flash memory devices and methods for fabricating the sameSPANSION LLC·Filed 2006·Granted May 6, 2008·18 cites·15 claims
- 0889US10424524B2Multiple wafers fabrication technique on large carrier with warpage control stiffenerDIDREW TECH BVI LIMITED·Filed 2018·Granted Sep 24, 2019·6 cites·20 claims
- 0985US9842820B1Wafer-level fan-out wirebond packagesALTERA CORP·Filed 2015·Granted Dec 12, 2017·5 cites·17 claims
- 1082US11274234B2Adhesive composition for temporary bonding of semiconductor workpiece and support carrier pairCHENGDU ESWIN SIP TECH CO LTD·Filed 2019·Granted Mar 15, 2022·5 cites·4 claims
- 1182US7732281B1Methods for fabricating dual bit flash memory devicesSPANSION LLC·Filed 2006·Granted Jun 8, 2010·8 cites·18 claims
- 1281US10209597B1System and method of manufacturing frameless LCD displayDIDREW TECH BVI LIMITED·Filed 2018·Granted Feb 19, 2019·5 cites·20 claims
- 1369US7635627B2Methods for fabricating a memory device including a dual bit memory cellSPANSION LLC·Filed 2006·Granted Dec 22, 2009·4 cites·20 claims
- 1461US7829936B2Split charge storage node inner spacer processSPANSION LLC·Filed 2007·Granted Nov 9, 2010·2 cites·16 claims
- 1561US7687360B2Method of forming spaced-apart charge trapping stacksSPANSION LLC·Filed 2006·Granted Mar 30, 2010·1 cites·20 claims
- 1653US7883963B2Split charge storage node outer spacer processSPANSION LLC·Filed 2007·Granted Feb 8, 2011·0 cites·15 claims
- 1752US7705390B2Dual bit flash memory devices and methods for fabricating the sameSPANSION LLC·Filed 2008·Granted Apr 27, 2010·0 cites·6 claims
- 1850US8012830B2ORO and ORPRO with bit line trench to suppress transport program disturbSPANSION LLC·Filed 2007·Granted Sep 6, 2011·0 cites·9 claims
- 1949US8039891B2Split charge storage node outer spacer processSPANSION LLC·Filed 2010·Granted Oct 18, 2011·0 cites·20 claims
- 2048US9224748B2Method of forming spaced-apart charge trapping stacksKINOSHITA HIROYUKI·Filed 2010·Granted Dec 29, 2015·0 cites·13 claims
- 2147US2016336259A1Silicon-glass hybrid interposer circuitryALTERA CORP·Filed 2016·Application pending·0 cites
- 2245US9245895B2Oro and orpro with bit line trench to suppress transport program disturbCHENG NING·Filed 2011·Granted Jan 26, 2016·0 cites·14 claims
- 2345US2021287953A1Embedded molding fan-out (emfo) packaging and method of manufacturing thereofDIDREW TECH BVI LIMITED·Filed 2020·Application pending·0 cites
- 2443US11488931B2Encapsulated fan-in semiconductor package with heat spreader and method of manufacturing the sameCHENGDU ESWIN SIP TECH CO LTD·Filed 2019·Granted Nov 1, 2022·0 cites·17 claims
- 2542US7867848B2Methods for fabricating dual bit flash memory devicesSPANSION LLC·Filed 2010·Granted Jan 11, 2011·0 cites·15 claims
- 2639US10734326B2Hermetic flat top integrated heat spreader (IHS)/electromagnetic interference (EMI) shield package and method of manufacturing thereof for reducing warpageDIDREW TECH BVI LIMITED·Filed 2018·Granted Aug 4, 2020·0 cites·17 claims
- 2739US2019259675A1Glass frame fan out packaging and method of manufacturing thereofDIDREW TECH BVI LIMITED·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →