Inventor · disambiguated record
Tai-Heui Cho
Also filed as: CHO TAI-HEUI
6 granted patents·7 pending applications·48 citations·filing 2001–2014
82Inventor score
Top patents by PatentIndex Score
13 records- 0169US6984895B2Bonding pad structure of a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jan 10, 2006·15 cites·7 claims
- 0265US7180154B2Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Feb 20, 2007·15 cites·10 claims
- 0362US7556989B2Semiconductor device having fuse pattern and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jul 7, 2009·3 cites·13 claims
- 0456US6806574B2Semiconductor device having multilevel interconnections and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Oct 19, 2004·8 cites·24 claims
- 0552US6867070B2Bonding pad structure of a semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 15, 2005·5 cites·8 claims
- 0647US2009236688A1Semiconductor device having fuse pattern and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 0744US7074712B2Semiconductor device having multilevel interconnections and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 11, 2006·2 cites·41 claims
- 0841US2014327056A1Semiconductor device having contact plug and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 0940US2007269979A1Method of forming a pattern and method of manufacturing a semiconductor device using the sameCHO TAI-HEUI·Filed 2007·Application pending·0 cites
- 1040US2007114635A1Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the sameCHO TAI-HEUI·Filed 2007·Application pending·0 cites
- 1139US2008029899A1Method of fabricating a semiconductor device and semiconductor device fabricated therebySONG DU-HEON·Filed 2007·Application pending·0 cites
- 1232US2003008453A1Semiconductor device having a contact window and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2002·Application pending·0 cites
- 1332US2002070457A1Metal contact structure in semiconductor device and method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Application pending·0 cites
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