Inventor · disambiguated record
Tetsunori Kaji
Also filed as: KAJI TETSUNORI
39 granted patents·20 pending applications·1,555 citations·filing 1974–2008
98Inventor score
Top patents by PatentIndex Score
59 records- 0199US6197151B1Plasma processing apparatus and plasma processing methodHITACHI LTD·Filed 2000·Granted Mar 6, 2001·223 cites·5 claims
- 0296US6245190B1Plasma processing system and plasma processing methodHITACHI LTD·Filed 1998·Granted Jun 12, 2001·194 cites·10 claims
- 0395US6171438B1Plasma processing apparatus and plasma processing methodHITACHI LTD·Filed 1999·Granted Jan 9, 2001·100 cites·48 claims
- 0495US6129806APlasma processing apparatus and plasma processing methodHITACHI LTD·Filed 1997·Granted Oct 10, 2000·92 cites·12 claims
- 0594US6815365B2Plasma etching apparatus and plasma etching methodHITACHI LTD·Filed 2001·Granted Nov 9, 2004·44 cites·10 claims
- 0694US6815228B2Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring methodHITACHI LTD·Filed 2001·Granted Nov 9, 2004·60 cites·7 claims
- 0791US5895586APlasma processing apparatus and plasma processing method in which a part of the processing chamber is formed using a pre-fluorinated material of aluminumHITACHI LTD·Filed 1995·Granted Apr 20, 1999·74 cites·5 claims
- 0891US5432315APlasma process apparatus including ground electrode with protection filmHITACHI LTD·Filed 1994·Granted Jul 11, 1995·68 cites·17 claims
- 0990US6422172B1Plasma processing apparatus and plasma processing methodHITACHI LTD·Filed 1998·Granted Jul 23, 2002·100 cites·11 claims
- 1088US6902683B1Plasma processing apparatus and plasma processing methodHITACHI LTD·Filed 2000·Granted Jun 7, 2005·29 cites·2 claims
- 1188US6903826B2Method and apparatus for determining endpoint of semiconductor element fabricating processHITACHI LTD·Filed 2001·Granted Jun 7, 2005·33 cites·20 claims
- 1288US3973252ALine progressive scanning method for liquid crystal display panelHITACHI LTD·Filed 1974·Granted Aug 3, 1976·46 cites·6 claims
- 1387US6758647B2System for producing wafersHITACHI HIGH TECH CORP·Filed 2002·Granted Jul 6, 2004·51 cites·7 claims
- 1486US6961131B2Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring methodHITACHI LTD·Filed 2004·Granted Nov 1, 2005·24 cites·6 claims
- 1585US5646489APlasma generator with mode restricting meansHITACHI LTD·Filed 1995·Granted Jul 8, 1997·43 cites·46 claims
- 1684US5580420APlasma generating method and apparatus and plasma processing method and apparatusHITACHI LTD·Filed 1994·Granted Dec 3, 1996·39 cites·52 claims
- 1781US7411684B2Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring methodHITACHI LTD·Filed 2007·Granted Aug 12, 2008·5 cites·13 claims
- 1881US6979168B2Method and apparatus for transferring substrateHITACHI HIGH TECH CORP·Filed 2002·Granted Dec 27, 2005·34 cites·4 claims
- 1980US7126697B2Method and apparatus for determining endpoint of semiconductor element fabricating processHITACHI LTD·Filed 2006·Granted Oct 24, 2006·5 cites·8 claims
- 2079US6172321B1Method and apparatus for plasma processing apparatusHITACHI LTD·Filed 1999·Granted Jan 9, 2001·26 cites·4 claims
- 2178US5804033AMicrowave plasma processing method and apparatusHITACHI LTD·Filed 1993·Granted Sep 8, 1998·32 cites·6 claims
- 2277US6034346AMethod and apparatus for plasma processing apparatusHITACHI LTD·Filed 1996·Granted Mar 7, 2000·27 cites·11 claims
- 2375US7230720B2Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring methodHITACHI LTD·Filed 2005·Granted Jun 12, 2007·3 cites·14 claims
- 2474US5433789AMethods and apparatus for generating plasma, and semiconductor processing methods using mode restricted microwavesHITACHI LTD·Filed 1993·Granted Jul 18, 1995·22 cites·27 claims
- 2573US6716300B2Emission spectroscopic processing apparatusHITACHI LTD·Filed 2002·Granted Apr 6, 2004·8 cites·5 claims
- 2673US5118378AApparatus for detecting an end point of etchingHITACHI LTD·Filed 1991·Granted Jun 2, 1992·35 cites·4 claims
- 2771US7455790B2Emission spectroscopic processing apparatus and plasma processing method using itHITACHI LTD·Filed 2005·Granted Nov 25, 2008·2 cites·6 claims
- 2871US5290993AMicrowave plasma processing deviceHITACHI LTD·Filed 1992·Granted Mar 1, 1994·42 cites·27 claims
- 2969US6890771B2Plasma processing method using spectroscopic processing unitHITACHI HIGH TECH CORP·Filed 2003·Granted May 10, 2005·6 cites·13 claims
- 3067US3935590AApparatus for displaying colored imageHITACHI LTD·Filed 1974·Granted Jan 27, 1976·11 cites·6 claims
- 3165US7009715B2Method and apparatus for determining endpoint of semiconductor element fabricating process and method and apparatus for processing member to be processedHITACHI LTD·Filed 2004·Granted Mar 7, 2006·7 cites·21 claims
- 3259US5391260AVacuum processing apparatusHITACHI LTD·Filed 1993·Granted Feb 21, 1995·24 cites·12 claims
- 3356US6596551B1Etching end point judging method, etching end point judging device, and insulating film etching method using these methodsHITACHI LTD·Filed 1999·Granted Jul 22, 2003·17 cites·15 claims
- 3456US2009008363A1Plasma processing apparatus and a plasma processing methodTAKAHASHI KAZUE·Filed 2008·Application pending·0 cites
- 3553US2006144518A1Plasma processing apparatus and plasma processing methodKAJI TETSUNORI·Filed 2006·Application pending·0 cites
- 3652US6046425APlasma processing apparatus having insulator disposed on inner surface of plasma generating chamberHITACHI LTD·Filed 1995·Granted Apr 4, 2000·10 cites·21 claims
- 3751US2006157449A1Plasma processing apparatus and a plasma processing methodTAKAHASHI KAZUE·Filed 2006·Application pending·0 cites
- 3846US2005082006A1Plasma processing apparatusFiled 2004·Application pending·0 cites
- 3945US2004178180A1Plasma processing apparatusFiled 2004·Application pending·0 cites
- 4045US2004045675A1Plasma etching apparatusFiled 2003·Application pending·0 cites
- 4145US2004016508A1Plasma etching apparatus and plasma etching methodFiled 2003·Application pending·0 cites
- 4245US2003203640A1Plasma etching apparatusFiled 2003·Application pending·0 cites
- 4345US2004009617A1Plasma etching apparatus and plasma etching methodFiled 2003·Application pending·0 cites
- 4445US2005236109A1Plasma etching apparatus and plasma etching methodMASUDA TOSHIO·Filed 2005·Application pending·0 cites
- 4544US5607510AVacuum processing apparatusHITACHI LTD·Filed 1995·Granted Mar 4, 1997·9 cites·7 claims
- 4644US2003024646A1Plasma etching apparatus and plasma etching methodFiled 2002·Application pending·0 cites
- 4742US2002069971A1Plasma processing apparatus and plasma processing methodFiled 2002·Application pending·0 cites
- 4841US2003036282A1Etching end point judging deviceFiled 2002·Application pending·0 cites
- 4940US7048869B2Plasma processing apparatus and a plasma processing methodHITACHI LTD·Filed 1999·Granted May 23, 2006·6 cites·9 claims
- 5037US2004166676A1Method and apparatus for forming damascene structure, and damascene structureFiled 2004·Application pending·0 cites
Showing the top 50 of 59 patent records by PatentIndex Score.
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