Inventor · disambiguated record
You Wang
Also filed as: WANG YOU · WANG YOU-SEN
35 granted patents·34 pending applications·1,372 citations·filing 1990–2023
98Inventor score
Top patents by PatentIndex Score
69 records- 0197US6310755B1Electrostatic chuck having gas cavity and methodAPPLIED MATERIALS INC·Filed 1999·Granted Oct 30, 2001·325 cites·38 claims
- 0296US6538872B1Electrostatic chuck having heater and methodAPPLIED MATERIALS INC·Filed 2001·Granted Mar 25, 2003·123 cites·18 claims
- 0394US6490146B2Electrostatic chuck bonded to base with a bond layer and methodAPPLIED MATERIALS INC·Filed 2001·Granted Dec 3, 2002·88 cites·28 claims
- 0493US6503368B1Substrate support having bonded sections and methodAPPLIED MATERIALS INC·Filed 2000·Granted Jan 7, 2003·76 cites·22 claims
- 0593US6490145B1Substrate support pedestalAPPLIED MATERIALS INC·Filed 2001·Granted Dec 3, 2002·86 cites·40 claims
- 0691US6583980B1Substrate support tolerant to thermal expansion stressesAPPLIED MATERIALS INC·Filed 2000·Granted Jun 24, 2003·60 cites·44 claims
- 0790US6723674B2Multi-component ceramic compositions and method of manufacture thereofINFRAMAT CORP·Filed 2001·Granted Apr 20, 2004·48 cites·24 claims
- 0888US6689424B1Solid lubricant coatings produced by thermal spray methodsINFRAMAT CORP·Filed 2000·Granted Feb 10, 2004·41 cites·21 claims
- 0988US6094334APolymer chuck with heater and method of manufactureAPPLIED MATERIALS INC·Filed 1999·Granted Jul 25, 2000·97 cites·58 claims
- 1087US8221667B2Method for making thermal interface materialYAO YUAN·Filed 2009·Granted Jul 17, 2012·16 cites·20 claims
- 1187US6055150AMulti-electrode electrostatic chuck having fuses in hollow cavitiesAPPLIED MATERIALS INC·Filed 1998·Granted Apr 25, 2000·101 cites·32 claims
- 1283US8081469B2Thermal interface material and method of using the same and electronic assembly having the sameWANG YOU-SEN·Filed 2009·Granted Dec 20, 2011·14 cites·20 claims
- 1383US7582564B2Process and composition for conductive material removal by electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Sep 1, 2009·9 cites·20 claims
- 1483US7214297B2Substrate support element for an electrochemical plating cellAPPLIED MATERIALS INC·Filed 2004·Granted May 8, 2007·30 cites·16 claims
- 1583US6462928B1Electrostatic chuck having improved electrical connector and methodAPPLIED MATERIALS INC·Filed 1999·Granted Oct 8, 2002·65 cites·13 claims
- 1683US5194138AMethod for creating a corrosion-resistant aluminum surfaceUNIV SOUTHERN CALIFORNIA·Filed 1990·Granted Mar 16, 1993·56 cites·42 claims
- 1782US11897079B2Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperityAPPLIED MATERIALS INC·Filed 2020·Granted Feb 13, 2024·1 cites·18 claims
- 1882US6639783B1Multi-layer ceramic electrostatic chuck with integrated channelAPPLIED MATERIALS INC·Filed 1998·Granted Oct 28, 2003·46 cites·19 claims
- 1980US8642121B2Thermal interface material having a patterned carbon nanotube array and method for making the sameDAI FENG-WEI·Filed 2009·Granted Feb 4, 2014·11 cites·12 claims
- 2079US7670688B2Erosion-resistant components for plasma process chambersAPPLIED MATERIALS INC·Filed 2001·Granted Mar 2, 2010·15 cites·32 claims
- 2177US8437136B2Thermal interface material and method of using the same and electronic assembly having the sameWANG YOU-SEN·Filed 2009·Granted May 7, 2013·9 cites·20 claims
- 2275US5582654AMethod for creating a corrosion-resistant surface on aluminum alloys having a high copper contentUNIV SOUTHERN CALIFORNIA·Filed 1994·Granted Dec 10, 1996·29 cites·30 claims
- 2372US7422982B2Method and apparatus for electroprocessing a substrate with edge profile controlAPPLIED MATERIALS INC·Filed 2006·Granted Sep 9, 2008·2 cites·11 claims
- 2472US2024066660A1Low-temperature metal cmp for minimizing dishing and corrosion, and improving pad asperityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2569US11911870B2Polishing pads for high temperature processingAPPLIED MATERIALS INC·Filed 2021·Granted Feb 27, 2024·0 cites·20 claims
- 2666US7344432B2Conductive pad with ion exchange membrane for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 18, 2008·3 cites·30 claims
- 2764US8586481B2Chemical planarization of copper wafer polishingWANG YOU·Filed 2011·Granted Nov 19, 2013·2 cites·8 claims
- 2863US7879255B2Method and composition for electrochemically polishing a conductive material on a substrateAPPLIED MATERIALS INC·Filed 2006·Granted Feb 1, 2011·1 cites·2 claims
- 2962US9073169B2Feedback control of polishing using optical detection of clearanceXU KUN·Filed 2011·Granted Jul 7, 2015·2 cites·26 claims
- 3062US7504018B2Electrochemical method for Ecmp polishing pad conditioningAPPLIED MATERIALS INC·Filed 2006·Granted Mar 17, 2009·1 cites·2 claims
- 3160US2006266655A1Multiple chemistry electrochemical plating methodSUN ZHI-WEN·Filed 2006·Application pending·0 cites
- 3256US2021046603A1Slurry temperature control by mixing at dispensingAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 3354US2008035474A1Apparatus for electroprocessing a substrate with edge profile controlWANG YOU·Filed 2007·Application pending·0 cites
- 3453US6652991B1Ductile NiAl intermetallic compositionsUNIV ALBERTA·Filed 2002·Granted Nov 25, 2003·5 cites·18 claims
- 3551US2008035882A1Composition for polishing a substrateZHAO JUNZI·Filed 2007·Application pending·0 cites
- 3650US2010273946A1Microcapsule, method for making the same, and composite using the sameUNIV TSINGHUA·Filed 2009·Application pending·0 cites
- 3750US2004154926A1Multiple chemistry electrochemical plating methodFiled 2003·Application pending·0 cites
- 3850US2009120799A1Multiple-step electrodeposition process for direct copper plating on barrier metalsSUN ZHI-WEN·Filed 2008·Application pending·0 cites
- 3950US2014102687A1Thermal interface materialHON HAI PREC IND CO LTD·Filed 2013·Application pending·0 cites
- 4048US2010096360A1Compositions and methods for barrier layer polishingAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 4148US2006175298A1Method and composition for polishing a substrateZHAO JUNZI·Filed 2006·Application pending·0 cites
- 4248US2005218000A1Conditioning of contact leads for metal plating systemsAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 4347US2007153453A1Fully conductive pad for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4446US2006249394A1Process and composition for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 4546US2007151866A1Substrate polishing with surface pretreatmentAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4644US7576007B2Method for electrochemically mechanically polishing a conductive material on a substrateAPPLIED MATERIALS INC·Filed 2006·Granted Aug 18, 2009·0 cites·16 claims
- 4744US2007079936A1Bonded multi-layer RF windowAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4844US2007181442A1Method and apparatus for foam removal in an electrochemical mechanical substrate polishing processAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4944US2006249395A1Process and composition for electrochemical mechanical polishingAPPLIED MATERIAL INC·Filed 2006·Application pending·0 cites
- 5044US2007158207A1Methods for electrochemical processing with pre-biased cellsAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
Showing the top 50 of 69 patent records by PatentIndex Score.
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