Thermal interface material

Abstract

A thermal interface material includes a low melting point metal matrix and a number of carbon nanotube arrays disposed in the low melting point matrix. The low melting point metal matrix includes a first surface and a second surface opposite to the first surface. Each carbon nanotube array includes a number of carbon nanotubes substantially parallel to each other. A number of first interspaces are defined between adjacent carbon nanotube arrays. The carbon nanotubes of the carbon nanotube arrays extend from the first surface to the second surface.

What is claimed is: 
     
         1 . A thermal interface material, comprising:
 a low melting point metal matrix comprising a first surface and a second surface opposite to the first surface;   a plurality of carbon nanotube arrays disposed in the low melting point metal matrix, each carbon nanotube array comprising a plurality of carbon nanotubes substantially parallel to each other; and   a plurality of first interspaces defined between adjacent carbon nanotube arrays, wherein the plurality of carbon nanotubes of the plurality of carbon nanotube arrays extend from the first surface to the second surface.   
     
     
         2 . The thermal interface material as claimed in  claim 1 , wherein each of the plurality of first interspaces is sized in a range from about 10 microns to about 500 microns. 
     
     
         3 . The thermal interface material as claimed in  claim 2 , wherein a plurality of second interspaces is defined between adjacent carbon nanotubes of each of the plurality of carbon nanotube arrays. 
     
     
         4 . The thermal interface material as claimed in  claim 3 , wherein each of the plurality of second interspaces is sized in a range from about 20 nanometers to about 500 nanometers. 
     
     
         5 . The thermal interface material as claimed in  claim 4 , wherein the material of the low melting point metal matrix is filled in the plurality of second interspaces and the plurality of first interspaces. 
     
     
         6 . The thermal interface material as claimed in  claim 1 , wherein one portion of the plurality of carbon nanotubes is exposed out of the low melting point metal matrix from the first surface. 
     
     
         7 . The thermal interface material as claimed in  claim 1 , wherein the low melting point metal matrix is made of indium (In), gallium (Ga), an alloy of antimony (Sb) and bismuth (Bi), an alloy of lead and tin, or any combination thereof. 
     
     
         8 . The thermal interface material as claimed in  claim 1 , wherein the melting point of the low melting point metal matrix is below 200° C. 
     
     
         9 . The thermal interface material as claimed in  claim 1 , wherein the thickness of the low melting point metal matrix is in a range from about 10 micros to about 1 millimeter. 
     
     
         10 . A thermal interface material, comprising:
 a plurality of carbon nanotube arrays spaced with each other, wherein each of the plurality of carbon nanotube arrays comprises a plurality of carbon nanotubes parallel to each other and extending from a same direction, each of a plurality of first interspaces is defined between two adjacent carbon nanotube arrays, and each of a plurality of second interspaces is defined between two adjacent carbon nanotubes of each of the plurality of carbon nanotube arrays; and   a low melting point metal material filled in the plurality of first interspaces and the plurality of second interspaces to form a low melting point metal matrix.   
     
     
         11 . The thermal interface material as claimed in  claim 10 , wherein one portion of the plurality of carbon nanotubes is exposed out of the low melting point metal matrix. 
     
     
         12 . The thermal interface material as claimed in  claim 10 , wherein each of the plurality of first interspaces is sized in a range from about 10 microns to about 500 microns. 
     
     
         13 . The thermal interface material as claimed in  claim 10 , wherein each of the plurality of second interspaces is sized in a range from about 20 nanometers to about 500 nanometers. 
     
     
         14 . The thermal interface material as claimed in  claim 1 , wherein the low melting point metal material is indium (In), gallium (Ga), an alloy of antimony (Sb) and bismuth (Bi), an alloy of lead and tin, or any combination thereof. 
     
     
         15 . The thermal interface material as claimed in  claim 10 , wherein the melting point of the low melting point metal material is below 200° C. 
     
     
         16 . The thermal interface material as claimed in  claim 10 , wherein the thickness of the low melting point metal matrix is in a range from about 10 micros to about 1 millimeter.