Inventor · disambiguated record
Tetsushi Nishio
Also filed as: NISHIO TETSUSHI
18 granted patents·8 pending applications·192 citations·filing 2003–2011
94Inventor score
Files withPANASONIC CORP11MATSUSHITA ELECTRIC INDUSTRIAL CO LTD9MINAMIO MASANORI2TAKEUCHI YASUO2ITOI KIYOKAZU1
Top patents by PatentIndex Score
26 records- 0192US8013350B2Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical devicePANASONIC CORP·Filed 2008·Granted Sep 6, 2011·28 cites·15 claims
- 0292US6897428B2Solid-state imaging device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted May 24, 2005·70 cites·13 claims
- 0384US7582944B2Optical apparatus and optical module using the samePANASONIC CORP·Filed 2007·Granted Sep 1, 2009·13 cites·19 claims
- 0484US7132315B2Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Nov 7, 2006·12 cites·6 claims
- 0575US7646539B2Optical device and manufacturing method thereofPANASONIC CORP·Filed 2009·Granted Jan 12, 2010·7 cites·15 claims
- 0674US7042071B2Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted May 9, 2006·18 cites·13 claims
- 0770US7977138B1Optical device and method of manufacturing the samePANASONIC CORP·Filed 2011·Granted Jul 12, 2011·3 cites·10 claims
- 0870US7153042B2Optic deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Dec 26, 2006·4 cites·17 claims
- 0967US7884437B2Semiconductor device and electronic apparatus using the samePANASONIC CORP·Filed 2009·Granted Feb 8, 2011·3 cites·7 claims
- 1066US7126209B2Lead frame, resin-encapsulated semiconductor device, and method of producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Oct 24, 2006·12 cites·5 claims
- 1162US7528884B2Optical devicePANASONIC CORP·Filed 2004·Granted May 5, 2009·10 cites·21 claims
- 1259US7928547B2Optical semiconductor devicePANASONIC CORP·Filed 2008·Granted Apr 19, 2011·1 cites·8 claims
- 1356US7911018B2Optical device and method of manufacturing the samePANASONIC CORP·Filed 2008·Granted Mar 22, 2011·1 cites·16 claims
- 1454US6864117B2Method for producing solid-state imaging deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Mar 8, 2005·6 cites·8 claims
- 1553US8077248B2Optical device and production method thereofMINAMIO MASANORI·Filed 2009·Granted Dec 13, 2011·0 cites·23 claims
- 1652US8080855B2Semiconductor device and method of manufacturing the sameMARUO TETSUMASA·Filed 2009·Granted Dec 20, 2011·2 cites·19 claims
- 1748US7580075B2Optical device and production method thereofPANASONIC CORP·Filed 2004·Granted Aug 25, 2009·2 cites·13 claims
- 1848US2009085139A1Solid-state image sensing device and method for manufacturing the sameTAKEUCHI YASUO·Filed 2008·Application pending·0 cites
- 1946US2011163328A1Optical semiconductor devicePANASONIC CORP·Filed 2011·Application pending·0 cites
- 2046US2007007633A1Lead frame, resin-encapsulated semiconductor device, and method of producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 2144US2005259174A1Solid state imaging device and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 2243US2011278692A1Solid-state image sensing device having a direct-attachment structure and method for manufacturing the sameTAKEUCHI YASUO·Filed 2011·Application pending·0 cites
- 2341US8455902B2Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical deviceITOI KIYOKAZU·Filed 2011·Granted Jun 4, 2013·0 cites·18 claims
- 2441US2006121184A1Photocurable-resin application method and bonding methodMINAMIO MASANORI·Filed 2005·Application pending·0 cites
- 2540US2008272473A1Optical device and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 2637US2010224948A1Solid-state imaging element, method for fabricating the same, and solid-state imaging devicePANASONIC CORP·Filed 2010·Application pending·0 cites
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