Optical semiconductor device

Abstract

An optical semiconductor device includes: a package having a bottom portion and a sidewall portion; a semiconductor chip having an optical element formed on one surface thereof and having an opposite surface to the one surface fixed to the bottom portion of the package; a transparent member fixed to the semiconductor chip so as to cover the optical element; and a sealing resin filling a space between the package and the semiconductor chip. The sidewall portion has in an upper part thereof an overhang portion that projects toward inside of the package. The transparent member is exposed from a window portion formed by the overhang portion.

1 - 8 . (canceled) 
     
     
         9 . An optical semiconductor device, comprising:
 a package having a bottom portion and a sidewall portion;   a semiconductor chip having an optical element formed on one surface thereof and having an opposite surface to the one surface, the opposite surface fixed to the bottom portion of the package;   a transparent member disposed over the semiconductor chip so as to cover the optical element;   wherein the sidewall portion has an overhang portion that projects inwardly toward the transparent member,   a side end face of the overhang portion and a side end face of the transparent member being separated by a first distance, the side end face of the overhang portion and the side end face of the transparent member facing one another,   a side end face of the sidewall portion disposed beneath the overhang portion and the side end face of the transparent member being separated by a second distance, the side end face of the sidewall portion disposed beneath the overhang portion and the side end face of the transparent member facing one another, and   the second distance is greater than the first distance.   
     
     
         10 . The optical semiconductor device according to  claim 9 , wherein at least a portion of the side end face of the overhang portion is not in contact with resin. 
     
     
         11 . The optical semiconductor device according to  claim 9 , further comprising a plurality of first wires and a plurality of second wires, the plurality of first wires electrically connected to the semiconductor chip and the plurality of second wires electrically connected to the semiconductor chip,
 wherein a length of at least one of the plurality of first wires is longer than a length of at least one of the plurality of second wires.   
     
     
         12 . The optical semiconductor device according to  claim 11 , wherein the plurality of first wires and the plurality of second wires are disposed in a peripheral portion of the semiconductor chip, and
 at least one of the plurality of second wires is disposed between two of the plurality of first wires.   
     
     
         13 . The optical semiconductor device according to  claim 9 , wherein the height of the side end face of the overhang portion is greater than the height of the side end surface of the transparent member, said height taken in the vertical direction relative to a top surface of the semiconductor chip. 
     
     
         14 . The optical semiconductor device according to  claim 9 , further comprising a wire electrically connected to the semiconductor chip, wherein the wire is not covered by the overhang portion. 
     
     
         15 . The optical semiconductor device according to  claim 9 , wherein a bottom surface of the overhang portion is lower than a top surface of the transparent member. 
     
     
         16 . The optical semiconductor device according to  claim 9 , wherein the overhang portion and the sidewall portion disposed beneath the overhang portion are formed integrally as a single member. 
     
     
         17 . The optical semiconductor device according to  claim 9 , wherein the optical element is one of a light receiving element and a light emitting element. 
     
     
         18 . The optical semiconductor device according to  claim 9 , wherein resin contacts said side end face of the sidewall portion disposed beneath the overhang portion. 
     
     
         19 . An optical semiconductor device, comprising:
 a package having a bottom portion and a sidewall portion;   a semiconductor chip having an optical element formed on one surface thereof and having an opposite surface to the one surface fixed to the bottom portion of the package;   a transparent member disposed over the semiconductor chip so as to cover the optical element; and   a sealing resin filling a space between the sidewall portion of the package and a side end face of the transparent member, wherein   the sidewall portion has an upper part thereof an overhang portion that projects toward inside of the package,   the transparent member is exposed from a window portion formed by the overhang portion,   a top surface of the sealing resin is located between the sidewall portion of the package and the side end face of the transparent member, said top surface of the sealing resin having a first part and a second part,   the first part is exposed from the window portion, and   the second part is covered by the overhang portion.