Inventor · disambiguated record
Atsushi Yoshimura
Also filed as: YOSHIMURA ATSUSHI
40 granted patents·8 pending applications·242 citations·filing 1994–2015
97Inventor score
Files withTOSHIBA KK19YOSHIMURA ATSUSHI9KATAMURA YUKIO3MITSUBISHI HEAVY IND LTD2NAT INST OF AGROBIO SCIENCES2
Top patents by PatentIndex Score
48 records- 0197US7629695B2Stacked electronic component and manufacturing method thereofTOSHIBA KK·Filed 2005·Granted Dec 8, 2009·51 cites·16 claims
- 0293US8513088B2Semiconductor device and method for manufacturing the sameYOSHIMURA ATSUSHI·Filed 2011·Granted Aug 20, 2013·24 cites·19 claims
- 0386US9024424B2Stacked electronic component and manufacturing method thereofYOSHIMURA ATSUSHI·Filed 2012·Granted May 5, 2015·6 cites·7 claims
- 0481US8302889B2Fuel injection valveHASHII NAOYA·Filed 2011·Granted Nov 6, 2012·4 cites·2 claims
- 0578US8008763B2Stacked electronic component and manufacturing method thereofTOSHIBA KK·Filed 2008·Granted Aug 30, 2011·5 cites·7 claims
- 0678US8002207B2Fuel injection valveMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Aug 23, 2011·8 cites·7 claims
- 0777US8691628B2Method of manufacturing semiconductor device, manufacturing program, and manufacturing apparatusTANE YASUO·Filed 2011·Granted Apr 8, 2014·7 cites·14 claims
- 0877US8659137B2Stacked semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2013·Granted Feb 25, 2014·4 cites·7 claims
- 0976US6425257B1Air conditionerMITSUBISHI HEAVY IND LTD·Filed 2001·Granted Jul 30, 2002·24 cites·10 claims
- 1075US8557635B2Stacked semiconductor device and manufacturing method thereofOMIZO SHOKO·Filed 2012·Granted Oct 15, 2013·5 cites·16 claims
- 1174US8796076B2Stacked semiconductor devices and fabrication method/equipment for the sameYOSHIMURA ATSUSHI·Filed 2012·Granted Aug 5, 2014·4 cites·15 claims
- 1273US6769481B2Outdoor heat exchanger unit, outdoor unit, and gas heat pump type air conditionerMITSUBISHI HEAVY IND LTD·Filed 2001·Granted Aug 3, 2004·27 cites·7 claims
- 1371US6686222B2Stacked semiconductor device manufacturing methodTOSHIBA KK·Filed 2002·Granted Feb 3, 2004·16 cites·26 claims
- 1470US7900533B2Control device for automatic transmissionTOYOTA MOTOR CO LTD·Filed 2008·Granted Mar 8, 2011·5 cites·4 claims
- 1568US8506102B2Indicator and display apparatusONO HARUYOSHI·Filed 2011·Granted Aug 13, 2013·2 cites·10 claims
- 1663US7880308B2Semiconductor deviceTOSHIBA KK·Filed 2006·Granted Feb 1, 2011·2 cites·14 claims
- 1762US7994620B2Stacked semiconductor deviceTOSHIBA KK·Filed 2007·Granted Aug 9, 2011·2 cites·12 claims
- 1862US7955896B2Method of manufacturing stacked semiconductor deviceTOSHIBA KK·Filed 2009·Granted Jun 7, 2011·2 cites·20 claims
- 1962US7615413B2Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic componentTOSHIBA KK·Filed 2006·Granted Nov 10, 2009·3 cites·6 claims
- 2061US7736999B2Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2007·Granted Jun 15, 2010·3 cites·9 claims
- 2160USD489076SInternal combustion engineYANMAR CO LTD·Filed 2002·Granted Apr 27, 2004·12 cites·1 claims
- 2257US6936123B2Apparatus for producing laminated electronic part and method of producing the partMURATA MANUFACTURING CO·Filed 2003·Granted Aug 30, 2005·8 cites·13 claims
- 2355US7785926B2Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic componentTOSHIBA KK·Filed 2009·Granted Aug 31, 2010·1 cites·8 claims
- 2453US8381706B2Head cover of an internal combustion engineHONDA MOTOR CO LTD·Filed 2008·Granted Feb 26, 2013·2 cites·7 claims
- 2553US2015214193A1Stacked electronic component and manufacturing method thereofTOSHIBA KK·Filed 2015·Application pending·0 cites
- 2652US8717263B2LCD unit, LCD apparatus, and method of setting drive voltage of LCD unitYOSHIMURA ATSUSHI·Filed 2007·Granted May 6, 2014·0 cites·4 claims
- 2752US7361805B2Ehd1 gene promoting plant flowering, and utilization thereofNAT INST OF AGROBIO SCIENCES·Filed 2003·Granted Apr 22, 2008·0 cites·16 claims
- 2851US8268673B2Stacked electronic component and manufacturing method thereofYOSHIMURA ATSUSHI·Filed 2011·Granted Sep 18, 2012·0 cites·20 claims
- 2948US7871856B2Method and apparatus for manufacturing stacked-type semiconductor deviceTOSHIBA KK·Filed 2005·Granted Jan 18, 2011·0 cites·3 claims
- 3046US8783207B2Meter pointer deviceONO HARUYOSHI·Filed 2011·Granted Jul 22, 2014·0 cites·3 claims
- 3146US8227296B2Stacked semiconductor deviceYOSHIMURA ATSUSHI·Filed 2011·Granted Jul 24, 2012·0 cites·18 claims
- 3246US2011079629A1Method and apparatus for manufacturing stacked-type semiconductor deviceTOSHIBA KK·Filed 2010·Application pending·0 cites
- 3345US7849897B2Apparatus and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2007·Granted Dec 14, 2010·0 cites·10 claims
- 3441US8276537B2Method for manufacturing semiconductor device and semiconductor manufacturing apparatusKATAMURA YUKIO·Filed 2011·Granted Oct 2, 2012·0 cites·9 claims
- 3541US5467803AOuter lead bending apparatus for a semiconductor package device having a package and outer leads extending from the packageTOSHIBA KK·Filed 1994·Granted Nov 21, 1995·12 cites·10 claims
- 3640US8240281B2Head cover of an internal combustion engineAKIYAMA YOSHIHIRO·Filed 2008·Granted Aug 14, 2012·0 cites·7 claims
- 3740US2007196952A1Manufacturing method of semiconductor deviceYOSHIMURA ATSUSHI·Filed 2007·Application pending·0 cites
- 3840US2012318431A1Method for manufacturing semiconductor device and semiconductor manufacturing apparatusKATAMURA YUKIO·Filed 2012·Application pending·0 cites
- 3939US8039364B2Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2010·Granted Oct 18, 2011·0 cites·11 claims
- 4039US2007023875A1Semiconductor package and manufacturing method thereofTOSHIBA KK·Filed 2006·Application pending·0 cites
- 4138US8629041B2Method for manufacturing semiconductor deviceTANE YASUO·Filed 2011·Granted Jan 14, 2014·0 cites·19 claims
- 4238US7141872B2Semiconductor device and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2004·Granted Nov 28, 2006·0 cites·8 claims
- 4338US2005205981A1Stacked electronic partTOSHIBA KK·Filed 2005·Application pending·0 cites
- 4437US6501007B1Method of dwarfing plantsNAT INST OF AGROBIO SCIENCES·Filed 1999·Granted Dec 31, 2002·3 cites·8 claims
- 4536US2011267796A1Nonvolatile memory device and method for manufacturing the sameYOSHIMURA ATSUSHI·Filed 2011·Application pending·0 cites
- 4635US8633602B2Semiconductor device, and method and apparatus for manufacturing the sameSUZUYA NOBUHITO·Filed 2012·Granted Jan 21, 2014·0 cites·5 claims
- 4734US2011263097A1Method for manufacturing semiconductor deviceYOSHIMURA ATSUSHI·Filed 2011·Application pending·0 cites
- 4833US9006029B2Method for manufacturing semiconductor devicesKATAMURA YUKIO·Filed 2011·Granted Apr 14, 2015·0 cites·19 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →