Stacked electronic component and manufacturing method thereof

Abstract

A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer thereon. The second adhesive layer has a two-layer structure formed by a same material and having different modulus of elasticity. The second adhesive layer of the two-layer structure has a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side. The first layer softens or melts at an adhesive temperature. The second layer maintains a layered shape at the adhesive temperature. According to the stacked electronic component, occurrences of an insulation failure and a short circuiting are prevented, and in addition, a peeling failure between the electronic components, an increase of a manufacturing cost, and so on, can be suppressed.

1 .- 20 . (canceled) 
     
     
         21 . A stacked electronic component, comprising:
 a substrate having electrode portions;   a first electronic component, adhered on the substrate via a first adhesive layer, having first electrode pads connected to the electrode portions via first bonding wires;   a second electronic component, adhered on the first electronic component via a second adhesive layer containing an insulating filler, having a protruding portion protruding outside from an outer periphery of the first electronic component and having second electrode pads connected to the electrode portions via second bonding wires; and   a sealing resin formed on the substrate to seal the first and second electronic components, the first and second adhesive layers, and the first and second bonding wires,   wherein the second adhesive layer is made of a first resin material, the insulating filler is made of a second resin material different from the first resin material, and the second adhesive layer is filled between the protruding portion and the substrate.   
     
     
         22 . The stacked electronic component according to  claim 21 ,
 wherein the first and second electronic components are constituted by at least one selected from a semiconductor element or a package component including a semiconductor element.   
     
     
         23 . The stacked electronic component according to  claim 21 ,
 wherein the insulating filler is contained in:
 a first portion of the second adhesive layer, the first portion being filled between the first and second electronic components, and 
 a second portion of the second adhesive layer, the second portion being filled between the protruding portion and the substrate. 
   
     
     
         24 . The stacked electronic component according to  claim 21 ,
 wherein the first electronic component has first and second edges, and the protruding portion has a first portion protruding outside from the first edge and a second portion protruding outside from the second edge, and
 wherein the second adhesive layer is filled between the first portion of the protruding portion and the substrate, and between the second portion of the protruding portion and the substrate. 
   
     
     
         25 . The stacked electronic component according to  claim 21 ,
 wherein the insulating filler has a size keeping a distance between the first and second electronic components, and functions as a spacer keeping the distance.   
     
     
         26 . The stacked electronic component according to  claim 21 ,
 wherein the second electrode pads are arranged on the protruding portion of the second electronic component.   
     
     
         27 . A stacked electronic component, comprising:
 a substrate having first electrode portions and second electrode portions;   a first electronic component, adhered on the substrate via a first adhesive layer, having first electrode pads connected to the first electrode portions via first bonding wires; and   a second electronic component, adhered on the first electronic component via a second adhesive layer containing an insulating filler, having second electrode pads connected to the second electrode portions via second bonding wires,   wherein the second adhesive layer is made of a first resin material, the insulating filler is made of a second resin material different from the first resin material.