Method and apparatus for manufacturing stacked-type semiconductor device

Abstract

A method of manufacturing a stacked-type semiconductor device, comprises: arranging a plurality of stacked chips obtained by stacking semiconductor chips on a plurality of stages on a support substrate; connecting a semiconductor chip of each stage in each stacked chip and the support substrate by wire while performing heating in units of stacked chips; performing plastic molding of each stacked chip; and separating the stacked chips from each other. An apparatus for manufacturing a stacked-type semiconductor device, comprising divided heater blocks formed under a support substrate on which a plurality of stacked chips obtained by stacking a plurality of semiconductor chips are arranged, the divided heater blocks being formed with respect to the stacked chips, and a heating device to selectively transmit heat to a stacked chip subjected to a wire bonding.

1 .- 4 . (canceled) 
     
     
         5 . An apparatus for manufacturing a stacked-type semiconductor device, comprising
 divided heater blocks formed under a support substrate on which a plurality of stacked chips obtained by stacking a plurality of semiconductor chips are arranged, the divided heater blocks being formed with respect to the stacked chips, and a heating device to selectively transmit heat to a stacked chip subjected to a wire bonding.   
     
     
         6 . The apparatus for manufacturing a stacked-type semiconductor device according to  claim 5 , wherein a selected one of the divided heater blocks is movable upward by means of a moving mechanism. 
     
     
         7 . The apparatus for manufacturing a stacked-type semiconductor device according to  claim 6 , wherein the moving mechanism comprises a cam plate having a profile varying height driven in a lateral direction and a cam follower coupled to a lower side of the selected heater block. 
     
     
         8 . The apparatus for manufacturing a stacked-type semiconductor device according to  claim 7 , wherein the cam follower is a roller. 
     
     
         9 . The apparatus for manufacturing a stacked-type semiconductor device according to  claim 6 , wherein said moving mechanism is provided for plural number. 
     
     
         10 . The apparatus for manufacturing a stacked-type semiconductor device according to  claim 9 , wherein a plurality of said moving mechanism are disposed in parallel and/or serially.