Inventor · disambiguated record
Wayne H. Huang
Also filed as: HUANG WAYNE · HUANG WAYNE H · HUANG WAYNE HAI-WEI
25 granted patents·4 pending applications·58 citations·filing 2008–2021
94Inventor score
Top patents by PatentIndex Score
29 records- 0197US9397078B1Semiconductor device assembly with underfill containment cavityMICRON TECHNOLOGY INC·Filed 2015·Granted Jul 19, 2016·24 cites·36 claims
- 0290US9412675B2Interconnect structure with improved conductive properties and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Aug 9, 2016·8 cites·17 claims
- 0386US11081460B2Methods and systems for manufacturing pillar structures on semiconductor devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 3, 2021·5 cites·22 claims
- 0480US10410879B2Uniform back side exposure of through-silicon viasMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 10, 2019·2 cites·11 claims
- 0579US9780052B2Collars for under-bump metal structures and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Oct 3, 2017·3 cites·24 claims
- 0678US9837383B2Interconnect structure with improved conductive properties and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Dec 5, 2017·2 cites·14 claims
- 0775US9941190B2Semiconductor device having through-silicon-via and methods of forming the sameMICRON TECHNOLOGY INC·Filed 2015·Granted Apr 10, 2018·2 cites·11 claims
- 0875US8226772B2Methods of removing particles from over semiconductor substratesGREELEY NEIL JOSEPH·Filed 2009·Granted Jul 24, 2012·2 cites·12 claims
- 0974US10886244B2Collars for under-bump metal structures and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Jan 5, 2021·2 cites·11 claims
- 1073US8940102B2Methods of removing particles from over semiconductor substratesGREELEY NEIL JOSEPH·Filed 2012·Granted Jan 27, 2015·1 cites·7 claims
- 1172US11139159B2Methods of removing particles from over semiconductor substratesMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 5, 2021·0 cites·5 claims
- 1272US8956974B2Devices, systems, and methods related to planarizing semiconductor devices after forming openingsHUANG WAYNE H·Filed 2012·Granted Feb 17, 2015·3 cites·27 claims
- 1372US8633084B1Methods of forming a memory cell having programmable material that comprises a multivalent metal oxide portion and an oxygen containing dielectric portionMICRON TECHNOLOGY INC·Filed 2012·Granted Jan 21, 2014·2 cites·35 claims
- 1471US10957625B2Pillar-last methods for forming semiconductor devicesMICRON TECHNOLOGY INC·Filed 2017·Granted Mar 23, 2021·1 cites·14 claims
- 1566US11631630B2Pillar-last methods for forming semiconductor devicesMICRON TECHNOLOGY INC·Filed 2021·Granted Apr 18, 2023·0 cites·20 claims
- 1666US11239129B2Package cooling by coil cavityMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 1, 2022·0 cites·19 claims
- 1765US9818622B2Uniform back side exposure of through-silicon viasMICRON TECHNOLOGY INC·Filed 2015·Granted Nov 14, 2017·1 cites·22 claims
- 1864US11735549B2Methods and systems for manufacturing pillar structures on semiconductor devicesMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 22, 2023·0 cites·18 claims
- 1963US10137481B2Methods of removing particles from over semiconductor substratesMICRON TECHNOLOGY INC·Filed 2015·Granted Nov 27, 2018·0 cites·8 claims
- 2062US10692733B2Uniform back side exposure of through-silicon viasMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 23, 2020·0 cites·12 claims
- 2162US2021151400A1Collars for under-bump metal structures and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Application pending·0 cites
- 2260US8809157B2Methods of forming a programmable region that comprises a multivalent metal oxide portion and an oxygen containing dielectric portionMICRON TECHNOLOGY INC·Filed 2013·Granted Aug 19, 2014·0 cites·31 claims
- 2358US10763186B2Package cooling by coil cavityMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 1, 2020·0 cites·31 claims
- 2454US10262922B2Semiconductor device having through-silicon-via and methods of forming the sameMICRON TECHNOLOGY INC·Filed 2018·Granted Apr 16, 2019·0 cites·20 claims
- 2553US2018040592A1Interconnect structure with improved conductive properties and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 2646US2015206801A1Devices, systems, and methods related to planarizing semiconductor devices after forming openingsMICRON TECHNOLOGY INC·Filed 2015·Application pending·0 cites
- 2743US8974655B2Methods of planarization and electro-chemical mechanical polishing processesHUANG WAYNE·Filed 2008·Granted Mar 10, 2015·0 cites·20 claims
- 2841US9153451B2Method of forming a planar surface for a semiconductor device structure, and related methods of forming a semiconductor device structureMICRON TECHNOLOGY INC·Filed 2012·Granted Oct 6, 2015·0 cites·22 claims
- 2934US2013313718A1Substrates Comprising Integrated Circuitry, Methods Of Processing A Substrate Comprising Integrated Circuitry, And Methods Of Back-Side Thinning A Substrate Comprising Integrated CircuitryVARGHESE SONY·Filed 2012·Application pending·0 cites
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