Inventor · disambiguated record
James C. Matayabas, Jr.
Also filed as: MATAYABAS JAMES C · MATAYABAS JR JAMES C · MATAYABAS JR JAMES CHRIS
14 granted patents·3 pending applications·18 citations·filing 2005–2019
87Inventor score
Top patents by PatentIndex Score
17 records- 0176US7534649B2Thermoset polyimides for microelectronic applicationsINTEL CORP·Filed 2006·Granted May 19, 2009·5 cites·10 claims
- 0271US7952212B2Applications of smart polymer composites to integrated circuit packagingINTEL CORP·Filed 2006·Granted May 31, 2011·5 cites·12 claims
- 0366US7224050B2Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packagingINTEL CORP·Filed 2005·Granted May 29, 2007·3 cites·11 claims
- 0465US7611985B2Formation of holes in substrates using dewetting coatingsINTEL CORP·Filed 2006·Granted Nov 3, 2009·3 cites·22 claims
- 0564US9646903B2Thermoset polymides for microelectronic applicationsMATAYABAS JR JAMES C·Filed 2014·Granted May 9, 2017·0 cites·7 claims
- 0662US9613933B2Package structure to enhance yield of TMI interconnectionsDE BONIS THOMAS J·Filed 2014·Granted Apr 4, 2017·2 cites·20 claims
- 0757US9604210B2Controlled fluid delivery in a microelectronic packageINTEL CORP·Filed 2015·Granted Mar 28, 2017·0 cites·11 claims
- 0857US9101931B2Controlled fluid delivery in a microelectronic packageSUPRIYA LAKSHMI·Filed 2007·Granted Aug 11, 2015·0 cites·18 claims
- 0954US9820384B2Flexible electronic assembly methodINTEL CORP·Filed 2013·Granted Nov 14, 2017·0 cites·12 claims
- 1052US10049971B2Package structure to enhance yield of TMI interconnectionsINTEL CORP·Filed 2017·Granted Aug 14, 2018·0 cites·3 claims
- 1149US8643199B2Thermoset polyimides for microelectronic applicationsLEHMAN JR STEPHEN E·Filed 2009·Granted Feb 4, 2014·0 cites·2 claims
- 1249US2018263117A1Flexible electronic assembly methodINTEL CORP·Filed 2017·Application pending·0 cites
- 1347US11545407B2Thermal management solutions for integrated circuit packagesINTEL CORP·Filed 2019·Granted Jan 3, 2023·0 cites·20 claims
- 1446US12046536B2Integrated heat spreader with enhanced vapor chamber for multichip packagesINTEL CORP·Filed 2019·Granted Jul 23, 2024·0 cites·16 claims
- 1545US11189574B2Microelectronic package having electromagnetic interference shieldingINTEL CORP·Filed 2017·Granted Nov 30, 2021·0 cites·24 claims
- 1640US2020273811A1Ic die package thermal spreader and emi shield comprising graphiteINTEL CORP·Filed 2019·Application pending·0 cites
- 1731US2019006259A1Cooling solution designs for microelectronic packagesINTEL CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →