Flexible electronic assembly method

Abstract

This disclosure relates generally to devices, systems, and methods for making a flexible microelectronic assembly. In an example, a polymer is molded over a microelectronic component, the polymer mold assuming a substantially rigid state following the molding. A routing layer is formed with respect to the microelectronic component and the polymer mold, the routing layer including traces electrically coupled to the microelectronic component. An input is applied to the polymer mold, the polymer mold transitioning from the substantially rigid state to a substantially flexible state upon application of the input.

1 . (canceled) 
     
     
         2 . An electronic assembly, comprising:
 a microelectronic component; and   a polymer mold encapsulating, at least in part, the microelectronic component;   wherein the polymer mold includes a modulus reducing input at least partially interspersed within a microstructure of the polymer.   
     
     
         3 . The electronic assembly of  claim 2 , wherein the polymer mold includes an interpenetrating polymer network. 
     
     
         4 . The electronic assembly of  claim 3 , wherein the interpenetrating polymer network includes a first network of macromolecules and a second network of macromolecules, and wherein the input causes the second network of macromolecules to at least partially dissolve while leaving the first network of macromolecules substantially intact. 
     
     
         5 . The electronic assembly of  claim 2 , wherein the routing layer further includes an insulator forming holes. 
     
     
         6 . The electronic assembly of  claim 5 , wherein the holes are grooves formed via at least one of embossing, etching, and scribing. 
     
     
         7 . The electronic assembly of  claim 2 , further comprising a plurality of microelectronic components, wherein the microelectronic component is one of the plurality of microelectronic components. 
     
     
         8 . The electronic assembly of  claim 7 , wherein at least some of the microelectronic components are dies. 
     
     
         9 . The electronic assembly of  claim 2 , further comprising a circuit board, the traces of the routing layer being coupled to the circuit board, 
     
     
         10 . The electronic assembly of  claim 9 , wherein the circuit board is a flexible circuit board.