Inventor · disambiguated record
Hao-Yin Tsai
Also filed as: TSAI HAO-YIN
1 granted patent·2 pending applications·37 citations·filing 2008–2009
46Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0191US7973310B2Semiconductor package structure and method for manufacturing the sameCHIPMOS TECHNOLOGIES INC·Filed 2009·Granted Jul 5, 2011·37 cites·44 claims
- 0241US2009236741A1Conductive structure of a chip and method for manufacturing the sameHUANG HSIANG-MING·Filed 2008·Application pending·0 cites
- 0341US2009283905A1Conductive structure of a chipHUANG HSIANG-MING·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →