Inventor · disambiguated record
Salman Kassir
Also filed as: KASSIR SALMAN M · KASSIR SALMAN MOUDREK
10 granted patents·2 pending applications·226 citations·filing 1997–2015
91Inventor score
Top patents by PatentIndex Score
12 records- 0187US5964646AGrinding process and apparatus for planarizing sawed wafersSTRASBAUGH·Filed 1997·Granted Oct 12, 1999·76 cites·6 claims
- 0285US7118446B2Grinding apparatus and methodSTRASBAUGH A CALIFORNIA CORP·Filed 2003·Granted Oct 10, 2006·25 cites·17 claims
- 0383US7458878B2Grinding apparatus and methodSTRASBAUGH A CALIFORNIA CORP·Filed 2006·Granted Dec 2, 2008·9 cites·19 claims
- 0482US6743722B2Method of spin etching wafers with an alkali solutionSTRASBAUGH·Filed 2002·Granted Jun 1, 2004·25 cites·17 claims
- 0571US7160808B2Chuck for supporting wafers with a fluidSTRASBAUGH·Filed 2004·Granted Jan 9, 2007·12 cites·10 claims
- 0671US6638389B2Method for applying an insert or tape to chucks or wafer carriers used for grinding, polishing, or planarizing wafersSTRASBAUGH·Filed 2002·Granted Oct 28, 2003·13 cites·2 claims
- 0770US6254155B1Apparatus and method for reliably releasing wet, thin wafersSTRASBAUGH INC·Filed 1999·Granted Jul 3, 2001·39 cites·11 claims
- 0869US7018268B2Protection of work piece during surface processingSTRASBAUGH·Filed 2003·Granted Mar 28, 2006·13 cites·28 claims
- 0962US7059942B2Method of backgrinding wafers while leaving backgrinding tape on a chuckSTRASBAUGH·Filed 2003·Granted Jun 13, 2006·8 cites·3 claims
- 1060US6866564B2Method of backgrinding wafers while leaving backgrinding tape on a chuckSTRASBAUGH·Filed 2002·Granted Mar 15, 2005·6 cites·40 claims
- 1144US2014057531A1Method for grinding wafers by shaping resilient chuck coveringKASSIR SALMAN M·Filed 2012·Application pending·0 cites
- 1233US2016288291A1Method for grinding wafers by shaping resilient chuck coveringSTRASBAUGH INC·Filed 2015·Application pending·0 cites
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