Inventor · disambiguated record
Hongqi Li
Also filed as: LI HONGQI
44 granted patents·7 pending applications·268 citations·filing 2010–2025
97Inventor score
Top patents by PatentIndex Score
51 records- 0196US8125740B1Disk drive actuator having a bobbin contacting a closed coil periphery at two locationsYANG JIAN·Filed 2010·Granted Feb 28, 2012·49 cites·21 claims
- 0295US10161560B2Integrated picomotor mountNEWPORT CORP·Filed 2016·Granted Dec 25, 2018·7 cites·26 claims
- 0395US8116038B1Depopulated disk drive head stack assembly having a necked dummy mass with relief alcovesZHANG QING·Filed 2010·Granted Feb 14, 2012·51 cites·18 claims
- 0494US8705201B2Information storage device with a damping insert sheet between a housing bay and a disk driveCASEY SHAWN E·Filed 2011·Granted Apr 22, 2014·54 cites·13 claims
- 0593US8667667B1Method for fabricating a disk drive base for a disk driveNGUYEN DIEP L·Filed 2011·Granted Mar 11, 2014·52 cites·10 claims
- 0689US11355508B2Devices including floating vias and related systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 7, 2022·2 cites·25 claims
- 0789US9263459B1Capping poly channel pillars in stacked circuitsLI HONGQI·Filed 2014·Granted Feb 16, 2016·11 cites·18 claims
- 0885US10389276B2Integral preload mechanism for piezoelectric actuatorNEWPORT CORP·Filed 2016·Granted Aug 20, 2019·2 cites·6 claims
- 0984US9754825B2Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Sep 5, 2017·3 cites·19 claims
- 1084US9099442B2Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2013·Granted Aug 4, 2015·4 cites·21 claims
- 1184US2025344409A1On-pitch vias for semiconductor devices and associated devices and systemsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1282US9036295B1Information storage device with a damping insert sheet between a housing bay and a disk driveWESTERN DIGITAL TECH INC·Filed 2014·Granted May 19, 2015·5 cites·18 claims
- 1381US9425711B2Integral preload mechanism for piezoelectric actuatorNEWPORT CORP·Filed 2014·Granted Aug 23, 2016·5 cites·33 claims
- 1481US9034752B2Methods of exposing conductive vias of semiconductor devices and associated structuresLI HONGQI·Filed 2013·Granted May 19, 2015·4 cites·26 claims
- 1579US9577192B2Method for forming a metal cap in a semiconductor memory deviceSONY CORP·Filed 2014·Granted Feb 21, 2017·3 cites·20 claims
- 1679US2025191972A1Methods of exposing conductive vias of semiconductor devicesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1776US12144188B2Multitier arrangements of integrated devices, and methods of forming sense/access linesMICRON TECHNOLOGY INC·Filed 2023·Granted Nov 12, 2024·0 cites·15 claims
- 1876US9911643B2Semiconductor constructions and methods of forming intersecting lines of materialMICRON TECHNOLOGY INC·Filed 2016·Granted Mar 6, 2018·2 cites·13 claims
- 1976US9116066B1Devices and methods for system-level disk drive vibration and shock testingTIAN JIFANG·Filed 2012·Granted Aug 25, 2015·4 cites·20 claims
- 2075US12363915B2On-pitch vias for semiconductor devices and associated devices and systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 15, 2025·0 cites·13 claims
- 2175US10546777B2Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Jan 28, 2020·1 cites·25 claims
- 2275US9922875B2Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Mar 20, 2018·1 cites·27 claims
- 2374US9613864B2Low capacitance interconnect structures and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Apr 4, 2017·3 cites·21 claims
- 2473US12237217B2Methods of exposing conductive Vias of semiconductor devices and related semiconductor devicesMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 25, 2025·0 cites·15 claims
- 2571US11770928B2Devices including floating viasMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 26, 2023·0 cites·20 claims
- 2671US11011420B2Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted May 18, 2021·0 cites·22 claims
- 2770US10825987B2Fabrication of electrodes for memory cellsMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 3, 2020·1 cites·9 claims
- 2869US11600666B2Multitier arrangements of integrated devices, and methods of forming sense/access linesMICRON TECHNOLOGY INC·Filed 2021·Granted Mar 7, 2023·0 cites·18 claims
- 2969US8911558B2Post-tungsten CMP cleaning solution and method of using the sameLI HONGQI·Filed 2011·Granted Dec 16, 2014·2 cites·7 claims
- 3067US11437435B2On-pitch vias for semiconductor devices and associated devices and systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 6, 2022·0 cites·20 claims
- 3165US11764147B2Slit oxide and via formation techniquesMICRON TECHNOLOGY INC·Filed 2021·Granted Sep 19, 2023·0 cites·20 claims
- 3263US9627295B2Devices, systems and methods for manufacturing through-substrate vias and front-side structuresMICRON TECHNOLOGY INC·Filed 2016·Granted Apr 18, 2017·1 cites·10 claims
- 3362US11545623B2Fabrication of electrodes for memory cellsMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 3, 2023·0 cites·16 claims
- 3460US10957741B2Multitier arrangements of integrated devices, and methods of forming sense/access linesMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 23, 2021·0 cites·6 claims
- 3560US10847442B2Interconnect assemblies with through-silicon vias and stress-relief featuresMICRON TECHNOLOGY INC·Filed 2014·Granted Nov 24, 2020·1 cites·17 claims
- 3656US10543579B2Polishing apparatuses and polishing methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Jan 28, 2020·0 cites·20 claims
- 3754US2025035568A1Radiation inspection systemNUCTECH CO LTD·Filed 2022·Application pending·0 cites
- 3853US11367681B2Slit oxide and via formation techniquesMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 21, 2022·0 cites·19 claims
- 3953US9391001B2Semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2013·Granted Jul 12, 2016·0 cites·16 claims
- 4052US10286517B2Polishing apparatusesMICRON TECHNOLOGY INC·Filed 2017·Granted May 14, 2019·0 cites·24 claims
- 4151US2015145146A1Methods of exposing conductive vias of semiconductor devices and related semiconductor devicesMICRON TECHNOLOGY INC·Filed 2015·Application pending·0 cites
- 4250US9911653B2Low capacitance interconnect structures and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Mar 6, 2018·0 cites·21 claims
- 4349US9305865B2Devices, systems and methods for manufacturing through-substrate vias and front-side structuresMICRON TECHNOLOGY INC·Filed 2013·Granted Apr 5, 2016·0 cites·14 claims
- 4449US2017133585A1Method for forming a metal cap in a semiconductor memory deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Application pending·0 cites
- 4548US10319678B2Capping poly channel pillars in stacked circuitsINTEL CORP·Filed 2015·Granted Jun 11, 2019·0 cites·18 claims
- 4645US11104309B2Fork-arm lift tractorUNIV TSINGHUA·Filed 2018·Granted Aug 31, 2021·0 cites·16 claims
- 4743US9330975B2Integrated circuit substrates comprising through-substrate vias and methods of forming through-substrate viasJINDAL ANURAG·Filed 2012·Granted May 3, 2016·0 cites·17 claims
- 4841US10197510B2Vehicle traction system and radiation imaging check systemNUCTECH CO LTD·Filed 2016·Granted Feb 5, 2019·0 cites·20 claims
- 4940US11203239B2Traction device and traction methodNUCTECH CO LTD·Filed 2018·Granted Dec 21, 2021·0 cites·20 claims
- 5039US2016294175A1Flexture-Type Strain Relief DeviceNEWPORT CORP·Filed 2014·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →