Assignee
LI HONGQI
US·3 granted patents·17 citations·filing 2011–2014
Top patents by PatentIndex Score
3 records- 0189US9263459B1Capping poly channel pillars in stacked circuitsLI HONGQI·Filed 2014·Granted Feb 16, 2016·11 cites·18 claims
- 0281US9034752B2Methods of exposing conductive vias of semiconductor devices and associated structuresLI HONGQI·Filed 2013·Granted May 19, 2015·4 cites·26 claims
- 0369US8911558B2Post-tungsten CMP cleaning solution and method of using the sameLI HONGQI·Filed 2011·Granted Dec 16, 2014·2 cites·7 claims
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