Inventor · disambiguated record
Abraham Ravid
Also filed as: RAVID ABRAHAM
22 granted patents·4 pending applications·107 citations·filing 2006–2020
94Inventor score
Top patents by PatentIndex Score
26 records- 0194US9405287B1Apparatus and method for optical calibration of wafer placement by a robotAPPLIED MATERIALS INC·Filed 2015·Granted Aug 2, 2016·11 cites·20 claims
- 0291US8125654B2Methods and apparatus for measuring substrate edge thickness during polishingBENVEGNU DOMINIC J·Filed 2009·Granted Feb 28, 2012·19 cites·16 claims
- 0391US7952708B2High throughput measurement systemAPPLIED MATERIALS INC·Filed 2008·Granted May 31, 2011·13 cites·21 claims
- 0490US7840375B2Methods and apparatus for generating a library of spectraAPPLIED MATERIALS INC·Filed 2008·Granted Nov 23, 2010·12 cites·23 claims
- 0590US7444198B2Determining physical property of substrateAPPLIED MATERIALS INC·Filed 2006·Granted Oct 28, 2008·17 cites·15 claims
- 0681US11430680B2Position and temperature monitoring of ALD platen susceptorAPPLIED MATERIALS INC·Filed 2019·Granted Aug 30, 2022·2 cites·12 claims
- 0781US10565701B2Color imaging for CMP monitoringAPPLIED MATERIALS INC·Filed 2015·Granted Feb 18, 2020·3 cites·20 claims
- 0881US10312120B2Position and temperature monitoring of ALD platen susceptorAPPLIED MATERIALS INC·Filed 2014·Granted Jun 4, 2019·4 cites·18 claims
- 0981US8014004B2Determining physical property of substrateAPPLIED MATERIALS INC·Filed 2010·Granted Sep 6, 2011·4 cites·20 claims
- 1077US7746485B2Determining physical property of substrateAPPLIED MATERIALS INC·Filed 2008·Granted Jun 29, 2010·6 cites·25 claims
- 1176US10260855B2Electroplating tool with feedback of metal thickness distribution and correctionAPPLIED MATERIALS INC·Filed 2013·Granted Apr 16, 2019·2 cites·9 claims
- 1275US10196741B2Wafer placement and gap control optimization through in situ feedbackAPPLIED MATERIALS INC·Filed 2014·Granted Feb 5, 2019·3 cites·17 claims
- 1370US9631919B2Non-contact sheet resistance measurement of barrier and/or seed layers prior to electroplatingAPPLIED MATERIALS INC·Filed 2013·Granted Apr 25, 2017·1 cites·10 claims
- 1468US8698889B2Metrology system for imaging workpiece surfaces at high robot transfer speedsRAVID ABRAHAM·Filed 2010·Granted Apr 15, 2014·3 cites·22 claims
- 1564US8452077B2Method for imaging workpiece surfaces at high robot transfer speeds with correction of motion-induced distortionRAVID ABRAHAM·Filed 2010·Granted May 28, 2013·4 cites·24 claims
- 1663US11119051B2Particle detection for substrate processingAPPLIED MATERIALS INC·Filed 2020·Granted Sep 14, 2021·0 cites·20 claims
- 1763US9490154B2Method of aligning substrate-scale mask with substrateAPPLIED MATERIALS INC·Filed 2015·Granted Nov 8, 2016·1 cites·8 claims
- 1862US11715193B2Color imaging for CMP monitoringAPPLIED MATERIALS INC·Filed 2020·Granted Aug 1, 2023·0 cites·17 claims
- 1960US9880233B2Methods and apparatus to determine parameters in metal-containing filmsRAVID ABRAHAM·Filed 2011·Granted Jan 30, 2018·1 cites·19 claims
- 2059US8639377B2Metrology for GST film thickness and phaseXU KUN·Filed 2008·Granted Jan 28, 2014·1 cites·32 claims
- 2157US2017226655A1Non-Contact Sheet Resistance Measurement of Barrier and/or Seed Layers Prior to ElectroplatingAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 2251US10845317B2Particle detection for substrate processingAPPLIED MATERIALS INC·Filed 2017·Granted Nov 24, 2020·0 cites·15 claims
- 2350US2011294400A1Determining Physical Property of SubstrateRAVID ABRAHAM·Filed 2011·Application pending·0 cites
- 2447US2011046918A1Methods and apparatus for generating a library of spectraRAVID ABRAHAM·Filed 2010·Application pending·0 cites
- 2540US2007123046A1Continuous in-line monitoring and qualification of polishing ratesAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2635US8620064B2Method for imaging workpiece surfaces at high robot transfer speeds with reduction or prevention of motion-induced distortionRAVID ABRAHAM·Filed 2010·Granted Dec 31, 2013·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →