Inventor · disambiguated record
Chen-Hao Lin
Also filed as: LIN CHEN-HAO
10 granted patents·10 pending applications·4 citations·filing 2017–2024
78Inventor score
Top patents by PatentIndex Score
20 records- 0185US11943877B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Mar 26, 2024·1 cites·6 claims
- 0278US11445617B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Sep 13, 2022·2 cites·13 claims
- 0377US10993332B2Circuit substrateUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Apr 27, 2021·1 cites·8 claims
- 0468US12504591B2Co-packaged structure for optics and electricsUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Dec 23, 2025·0 cites·13 claims
- 0567US12414243B2Manufacturing method of package structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Sep 9, 2025·0 cites·10 claims
- 0661US2025323232A1Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0761US2025149426A1Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0861US2024248264A1Package structureUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0959US11895780B2Manufacturing method of package structureUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Feb 6, 2024·0 cites·5 claims
- 1057US11523503B2Wiring board and method of forming hole thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Dec 6, 2022·0 cites·12 claims
- 1156US2025331108A1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1253US2024251504A1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 1350US2023178520A1Light-emitting diode package and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 1448US11219130B2Circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jan 4, 2022·0 cites·9 claims
- 1547US2017374748A1Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2017·Application pending·0 cites
- 1647US2023093870A1Method for Forming Resistance on Circuit Board and Circuit Board Having ResistanceUNIMICRON TECH CORPORATION·Filed 2021·Application pending·0 cites
- 1746US11166387B2Wiring board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Nov 2, 2021·0 cites·7 claims
- 1844US11682658B2Light-emitting package and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Jun 20, 2023·0 cites·9 claims
- 1944US2020068721A1Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Application pending·0 cites
- 2040US2022131054A1Light-emitting package and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2020·Application pending·0 cites
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