Assignee
UNIMICRON TECH CORPORATION
TW·12 granted patents·2 pending applications·0 citations·filing 2012–2023
Top patents by PatentIndex Score
14 records- 0176US12101881B2Circuit board assemblyUNIMICRON TECH CORPORATION·Filed 2023·Granted Sep 24, 2024·0 cites·8 claims
- 0268US11825604B2Circuit board assemblyUNIMICRON TECH CORPORATION·Filed 2021·Granted Nov 21, 2023·0 cites·15 claims
- 0359US12232254B2Printed circuit board and manufacturing method thereofUNIMICRON TECH CORPORATION·Filed 2022·Granted Feb 18, 2025·0 cites·10 claims
- 0459US11824012B2Integrated circuit package structure and method of manufacturing the sameUNIMICRON TECH CORPORATION·Filed 2020·Granted Nov 21, 2023·0 cites·7 claims
- 0556US11408799B2Device and method for measuring thickness of dielectric layer in circuit boardUNIMICRON TECH CORPORATION·Filed 2021·Granted Aug 9, 2022·0 cites·11 claims
- 0654US10080295B2Circuit board structureUNIMICRON TECH CORPORATION·Filed 2012·Granted Sep 18, 2018·0 cites·8 claims
- 0753US10076039B2Method of fabricating packaging substrateUNIMICRON TECH CORPORATION·Filed 2014·Granted Sep 11, 2018·0 cites·9 claims
- 0848US11408720B2Device and method for measuring thickness of dielectric layer in circuit boardUNIMICRON TECH CORPORATION·Filed 2021·Granted Aug 9, 2022·0 cites·7 claims
- 0947US11222838B2Embedded component substrate structure having bridge chip and method for manufacturing the sameUNIMICRON TECH CORPORATION·Filed 2020·Granted Jan 11, 2022·0 cites·8 claims
- 1047US2023093870A1Method for Forming Resistance on Circuit Board and Circuit Board Having ResistanceUNIMICRON TECH CORPORATION·Filed 2021·Application pending·0 cites
- 1145US2023097273A1Method and Drill for Removing Partial Metal Wall of HoleUNIMICRON TECH CORPORATION·Filed 2021·Application pending·0 cites
- 1244US11585648B2Electromagnetic measuring probe device for measuring a thickness of a dielectric layer of a circuit board and method thereofUNIMICRON TECH CORPORATION·Filed 2021·Granted Feb 21, 2023·0 cites·12 claims
- 1341US10820411B1Manufacturing method for circuit board and circuit board thereofUNIMICRON TECH CORPORATION·Filed 2020·Granted Oct 27, 2020·0 cites·10 claims
- 1436US11497115B2Carrier board structure with an increased core-layer trace area and method for manufacturing sameUNIMICRON TECH CORPORATION·Filed 2020·Granted Nov 8, 2022·0 cites·5 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →