Inventor · disambiguated record
David L. Gardell
Also filed as: GARDELL DAVID L · GARDELL DAVID LEWIS
42 granted patents·1 pending application·899 citations·filing 1992–2019
98Inventor score
Top patents by PatentIndex Score
43 records- 0195US6351134B2Semiconductor wafer test and burn-inIBM·Filed 1999·Granted Feb 26, 2002·127 cites·24 claims
- 0293US8471575B2Methodologies and test configurations for testing thermal interface materialsFREGEAU DUSTIN·Filed 2010·Granted Jun 25, 2013·22 cites·15 claims
- 0393US6275051B1Segmented architecture for wafer test and burn-inIBM·Filed 1999·Granted Aug 14, 2001·127 cites·27 claims
- 0491US6086387ACover assembly for a socket adaptable to IC modules of varying thickness used for burn-in testingIBM·Filed 1998·Granted Jul 11, 2000·114 cites·23 claims
- 0591US5929651ASemiconductor wafer test and burn-inIBM·Filed 1996·Granted Jul 27, 1999·80 cites·41 claims
- 0689US6050326AMethod and apparatus for cooling an electronic deviceIBM·Filed 1998·Granted Apr 18, 2000·103 cites·24 claims
- 0784US7259580B2Method and apparatus for temporary thermal coupling of an electronic device to a heat sink during testIBM·Filed 2005·Granted Aug 21, 2007·15 cites·17 claims
- 0880US6911836B2Apparatus for functional and stress testing of exposed chip land grid array devicesIBM·Filed 2003·Granted Jun 28, 2005·26 cites·18 claims
- 0979US5628889AHigh power capacity magnetron cathodeIBM·Filed 1994·Granted May 13, 1997·34 cites·18 claims
- 1075US9797928B2Probe card assemblyIBM·Filed 2014·Granted Oct 24, 2017·2 cites·18 claims
- 1175US8002025B2Containment of a wafer-chuck thermal interface fluidIBM·Filed 2006·Granted Aug 23, 2011·6 cites·25 claims
- 1275US6720789B1Method for wafer test and wafer test system for implementing the methodIBM·Filed 2003·Granted Apr 13, 2004·19 cites·17 claims
- 1375US5585600AEncapsulated semiconductor chip module and method of forming the sameIBM·Filed 1993·Granted Dec 17, 1996·57 cites·8 claims
- 1474US7567090B2Liquid recovery, collection method and apparatus in a non-recirculating test and burn-in applicationIBM·Filed 2006·Granted Jul 28, 2009·9 cites·20 claims
- 1573US9116200B2Methodologies and test configurations for testing thermal interface materialsIBM·Filed 2013·Granted Aug 25, 2015·2 cites·19 claims
- 1673US7808099B2Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related methodIBM·Filed 2008·Granted Oct 5, 2010·3 cites·3 claims
- 1773US6504392B2Actively controlled heat sink for convective burn-in ovenIBM·Filed 1999·Granted Jan 7, 2003·38 cites·43 claims
- 1872US10041976B2Gimbal assembly test system and methodGLOBALFOUNDRIES INC·Filed 2016·Granted Aug 7, 2018·1 cites·4 claims
- 1970US6577146B2Method of burning in an integrated circuit chip packageIBM·Filed 2001·Granted Jun 10, 2003·16 cites·6 claims
- 2068US11085949B2Probe card assemblyIBM·Filed 2019·Granted Aug 10, 2021·0 cites·20 claims
- 2167US7684194B2Systems and methods for cooling an electronic deviceIBM·Filed 2008·Granted Mar 23, 2010·3 cites·23 claims
- 2266US8686749B2Thermal interface material, test structure and method of useERWIN BRIAN M·Filed 2010·Granted Apr 1, 2014·3 cites·24 claims
- 2365US6012020AApparatus and method for monitoring the condition of septic tanksFiled 1998·Granted Jan 4, 2000·32 cites·16 claims
- 2465US5252062AThermal processing furnaceIBM·Filed 1992·Granted Oct 12, 1993·17 cites·21 claims
- 2563US7084651B2Probe card assemblyIBM·Filed 2004·Granted Aug 1, 2006·10 cites·31 claims
- 2662US10732202B2Repairable rigid test probe card assemblyGLOBALFOUNDRIES INC·Filed 2016·Granted Aug 4, 2020·1 cites·19 claims
- 2762US8836356B2Vertical probe assembly with air channelAUDETTE DAVID M·Filed 2011·Granted Sep 16, 2014·1 cites·14 claims
- 2861US10578648B2Probe card assemblyIBM·Filed 2017·Granted Mar 3, 2020·0 cites·20 claims
- 2961US10514393B2Gimbal assembly test system and methodGLOBALFOUNDRIES INC·Filed 2018·Granted Dec 24, 2019·0 cites·20 claims
- 3060US10571490B2Solder bump array probe tip structure for laser cleaningIBM·Filed 2017·Granted Feb 25, 2020·0 cites·16 claims
- 3159US7964542B2Enhanced thermo-oxidative stability thermal interface compositions and use thereof in microelectronics assemblyIBM·Filed 2006·Granted Jun 21, 2011·1 cites·21 claims
- 3254US9835653B2Solder bump array probe tip structure for laser cleaningIBM·Filed 2014·Granted Dec 5, 2017·0 cites·13 claims
- 3353US9086433B2Rigid probe with compliant characteristicsIBM·Filed 2012·Granted Jul 21, 2015·0 cites·15 claims
- 3453US9081034B2Rigid probe with compliant characteristicsIBM·Filed 2013·Granted Jul 14, 2015·0 cites·8 claims
- 3551US6173760B1Co-axial bellows liquid heatsink for high power module testIBM·Filed 1998·Granted Jan 16, 2001·22 cites·28 claims
- 3649US10429414B2Multiple contact probe head disassembly method and systemGLOBALFOUNDRIES INC·Filed 2016·Granted Oct 1, 2019·0 cites·9 claims
- 3747US9152517B2Programmable active thermal controlCHASE HAROLD·Filed 2011·Granted Oct 6, 2015·1 cites·16 claims
- 3844US8917105B2Solder bump testing apparatus and methods of useGARDELL DAVID L·Filed 2012·Granted Dec 23, 2014·0 cites·14 claims
- 3944US6590404B2Force and centrality measuring toolIBM·Filed 2001·Granted Jul 8, 2003·6 cites·9 claims
- 4041US7332927B2Apparatus for temporary thermal coupling of an electronic device to a heat sink during testIBM·Filed 2007·Granted Feb 19, 2008·0 cites·20 claims
- 4140US7265561B2Device burn in utilizing voltage controlIBM·Filed 2003·Granted Sep 4, 2007·1 cites·12 claims
- 4238US10288645B2Organic probe substrateIBM·Filed 2015·Granted May 14, 2019·0 cites·13 claims
- 4333US2001050567A1Segmented architecture for wafer test & burn-inIBM·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →