Inventor · disambiguated record
Tomokazu Takahashi
Also filed as: TAKAHASHI TOMOKAZU
14 granted patents·42 pending applications·205 citations·filing 1984–2022
91Inventor score
Top patents by PatentIndex Score
56 records- 0196US5450436ALaser gas replenishing apparatus and method in excimer laser systemKOMATSU MFG CO LTD·Filed 1993·Granted Sep 12, 1995·123 cites·31 claims
- 0281US9413272B2Power generation device having a dielectric body and an electretAOYAGI SEIJI·Filed 2012·Granted Aug 9, 2016·4 cites·22 claims
- 0381US7514143B2Re-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2004·Granted Apr 7, 2009·17 cites·13 claims
- 0480US8727757B2Molding die set and resin molding apparatus having the sameMAEKAWA MASANORI·Filed 2012·Granted May 20, 2014·8 cites·11 claims
- 0580US8603630B2Radiation-curable adhesive composition and adhesive sheetTAKAHASHI TOMOKAZU·Filed 2011·Granted Dec 10, 2013·7 cites·11 claims
- 0676US7586060B2Protective sheet for laser processing and manufacturing method of laser processed partsNITTO DENKO CORP·Filed 2004·Granted Sep 8, 2009·13 cites·16 claims
- 0775US8643194B2Dicing tape-integrated film for semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2011·Granted Feb 4, 2014·4 cites·10 claims
- 0866US2024409789A1Laminate, optical member, and optical apparatusNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 0963US2024409788A1Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet using said pressure-sensitive adhesive compositionNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 1059US8778118B2Manufacturing method of laser processed parts, and pressure-sensitive adhesive sheet for laser processing used for the sameURAIRI MASAKATSU·Filed 2010·Granted Jul 15, 2014·1 cites·8 claims
- 1158US2024228847A1Surface-modifying layer, surface-modifying sheet, laminate, surface-modified member, coated article, method for producing surface-modified member, and method for producing coated articleNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 1257US4569550AApparatus for automatically mounting electronic circuit element on printed circuit boardTDK CORP·Filed 1984·Granted Feb 11, 1986·14 cites·12 claims
- 1355US2023167336A1Adhesive sheetNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 1455US2023167337A1Adhesive sheetNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 1554US2023019125A1Adhesive sheetNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 1652US2010028669A1Re-releasable adhesive agent and re-releasable adhesive sheetNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 1751US2001005833A1Product distribution system and method for providing information to customer in context of such systemFiled 2000·Application pending·0 cites
- 1850US12161354B2Adhering body and adhesion deviceTHE SCHOOL CORPORATION KANSAI UNIV·Filed 2019·Granted Dec 10, 2024·0 cites·8 claims
- 1948US2008057306A1Adhesive sheet for laser processingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2048US2011220268A1Surface protection tape for dicing and method for peeling and removing surface protection tape for dicingNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 2148US2010032087A1Pressure-sensitive adhesive sheet for laser processing and laser processing methodNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 2247US2006246279A1Method of producing laser-processed product and adhesive sheet, for laser processing used thereforURAIRI MASAKATSU·Filed 2004·Application pending·0 cites
- 2347US2012165471A1Radiation-curable adhesive composition and adhesive sheetTAKAHASHI TOMOKAZU·Filed 2011·Application pending·0 cites
- 2446US2009065133A1Pressure-sensitive adhesive sheet for dicing and dicing methodNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 2546US2011008949A1Adhesive sheet for dicing semiconductor wafer and method for dicing semiconductor wafer using the sameNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 2646US2013273361A1Active Energy Ray-Curable Pressure-Sensitive Adhesive for Re-Release and Dicing Die-Bonding FilmNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 2746US2010080989A1Pressure-sensitive adhesive sheet for laser processing and method for laser processingNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 2845US2008085409A1Heat-resistant dicing tape or sheetNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2945US2008193728A1Pressure-sensitive adhesive sheet, method for producing the same and method for using the same as well as a multi-layer sheet for use in the pressure-sensitive adhesive sheet and method for producing the sameNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 3044US2008011415A1Method for working object to be workedKIUCHI KAZUYUKI·Filed 2007·Application pending·0 cites
- 3143US7242992B2Parts supply system problem detection support system and method, and program for the sameTOYOTA MOTOR CO LTD·Filed 2003·Granted Jul 10, 2007·4 cites·12 claims
- 3243US2007190318A1Pressure-sensitive adhesive tape or sheet for application to active surface in dicing and method of picking up chips of workNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 3343US2008085397A1Adhesive sheet for laser processingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 3443US2008138618A1Removable pressure-sensitive adhesive composition and pressure-sensitive adhesive tape or sheetNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 3541US6418155B1Laser deviceKOMATSU MFG CO LTD·Filed 1997·Granted Jul 9, 2002·10 cites·25 claims
- 3641US2008057253A1Adhesive sheet for water jet laser dicingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 3741US2008057270A1Adhesive sheet for water jet laser dicingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 3841US2008182095A1Adhesive sheet for water jet laser dicingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 3941US2008108262A1Adhesive sheet for water jet laser dicingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 4040US2014004637A1Method of manufacturing an ledNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 4140US2014004635A1Method of manufacturing an ledNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 4240US2014004636A1Method of manufacturing an ledNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 4340US2012003470A1Active energy ray-curable pressure-sensitive adhesive for re-release and dicing die-bonding filmKAMIYA KATSUHIKO·Filed 2011·Application pending·0 cites
- 4440US2014000793A1Method of manufacturing an ledNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 4539US2006257651A1Pressure-sensitive adhesive sheet for use in dicing and method of processing products worked with itSHINTANI TOSHIO·Filed 2006·Application pending·0 cites
- 4639US2005153129A1Pressure-sensitive adhesive sheet, method for producing the same and method for using the same as well as a multi-layer sheet for use in the pressure-sensitive adhesive sheet and method for producing the sameNITTO DENKO CORP·Filed 2005·Application pending·0 cites
- 4737US2004126575A1Pressure-sensitive adhesive sheet, method for producing the same and method for using the same as well as a multi-layer sheet for use in the pressure-sensitive adhesive sheet and method for producing the sameNITTO DENKO CORP·Filed 2003·Application pending·0 cites
- 4837US2009311474A1Adhesive sheet for water jet laser dicingTAKAHASHI TOMOKAZU·Filed 2008·Application pending·0 cites
- 4937US2011076490A1Pressure-sensitive adhesive sheet for retaining elements and method of producing elementsNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 5035US8546958B2Pressure-sensitive adhesive sheet for protecting semiconductor waferHABU TAKASHI·Filed 2011·Granted Oct 1, 2013·0 cites·5 claims
Showing the top 50 of 56 patent records by PatentIndex Score.
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