Assignee
HABU TAKASHI
JP·2 granted patents·1 pending application·0 citations·filing 2010–2011
Top patents by PatentIndex Score
3 records- 0135US8546958B2Pressure-sensitive adhesive sheet for protecting semiconductor waferHABU TAKASHI·Filed 2011·Granted Oct 1, 2013·0 cites·5 claims
- 0231US8388786B2Substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, method for grinding back side of semiconductor wafer using pressure-sensitive adhesive sheet, and method for producing pressure-sensitive adhesive sheetHABU TAKASHI·Filed 2010·Granted Mar 5, 2013·0 cites·1 claims
- 0329US2012065350A1Viscoelastic body and method for manufacturing the sameHABU TAKASHI·Filed 2011·Application pending·0 cites
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