Inventor · disambiguated record
Hee-Sub Hwang
Also filed as: HWANG HEE SUB
2 granted patents·5 pending applications·2 citations·filing 2009–2015
37Inventor score
Top patents by PatentIndex Score
7 records- 0173US9287132B2Multi-selective polishing slurry composition and a semiconductor element production method using the sameIUCF HYU·Filed 2015·Granted Mar 15, 2016·2 cites·13 claims
- 0244US9163314B2CMP slurry composition for tungstenPARK JEA-GUN·Filed 2012·Granted Oct 20, 2015·0 cites·2 claims
- 0344US2009275188A1Slurry for polishing phase change material and method for patterning polishing phase change material using the samePARK JEA GUN·Filed 2009·Application pending·0 cites
- 0441US2012190201A1Multi-selective polishing slurry composition and a semiconductor element production method using the samePARK JEA-GUN·Filed 2010·Application pending·0 cites
- 0538US2013032572A1Slurry for polishing phase-change materials and method for producing a phase-change device using sameIUCF HYU·Filed 2011·Application pending·0 cites
- 0636US2014312266A1Polishing slurry and method of polishing using the sameUBMATERIALS INC·Filed 2012·Application pending·0 cites
- 0735US2015337173A1Slurry for polishing phase-change materials and method for producing a phase-change device using sameIUCF HYU·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →