Inventor · disambiguated record
Jens Goerlich
Also filed as: GOERLICH JENS
2 granted patents·1 pending application·1 citations·filing 2009–2010
30Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0154US8298867B2Method for fabricating a circuit substrate assembly and a power electronics module comprising an anchoring structure for producing a changing temperature-stable solder bondHOHLFELD OLAF·Filed 2010·Granted Oct 30, 2012·1 cites·24 claims
- 0243US2010068552A1Module including a stable solder jointINFINEON TECHNOLOGIES AG·Filed 2009·Application pending·0 cites
- 0340US8637379B2Device including a semiconductor chip and a carrier and fabrication methodEDER HANNES·Filed 2009·Granted Jan 28, 2014·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →