Assignee
HOHLFELD OLAF
DE·3 granted patents·16 citations·filing 2010–2010
Top patents by PatentIndex Score
3 records- 0184US8587116B2Semiconductor module comprising an insertHOHLFELD OLAF·Filed 2010·Granted Nov 19, 2013·8 cites·14 claims
- 0282US8134837B2Twist-secured assembly of a power semiconductor module mountable on a heat sinkHOHLFELD OLAF·Filed 2010·Granted Mar 13, 2012·7 cites·21 claims
- 0354US8298867B2Method for fabricating a circuit substrate assembly and a power electronics module comprising an anchoring structure for producing a changing temperature-stable solder bondHOHLFELD OLAF·Filed 2010·Granted Oct 30, 2012·1 cites·24 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →