Inventor · disambiguated record
Asri Yusof
Also filed as: YUSOF ASRI · YUSOF ASRI BIN
6 granted patents·29 citations·filing 2008–2014
79Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0188US9368423B2Semiconductor device and method of using substrate with conductive posts and protective layers to form embedded sensor die packageSTATS CHIPPAC LTD·Filed 2013·Granted Jun 14, 2016·10 cites·34 claims
- 0288US8937379B1Integrated circuit packaging system with trenched leadframe and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Jan 20, 2015·10 cites·9 claims
- 0373US9190349B1Integrated circuit packaging system with leadframe and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Nov 17, 2015·3 cites·20 claims
- 0473US9105620B1Integrated circuit packaging system with routable traces and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Aug 11, 2015·3 cites·20 claims
- 0556US7901988B2Method for forming a package-on-package structureEEMS ASIA PTE LTD·Filed 2008·Granted Mar 8, 2011·3 cites·17 claims
- 0649US9142530B2Coreless integrated circuit packaging system and method of manufacture thereofDO BYUNG TAI·Filed 2014·Granted Sep 22, 2015·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →