Inventor · disambiguated record
Gerd Marxsen
Also filed as: MARXSEN GERD · MARXSEN GERD F C · MARXSEN GERD FRANZ CHRISTIAN
19 granted patents·8 pending applications·281 citations·filing 1998–2010
95Inventor score
Files withADVANCED MICRO DEVICES INC13MARXSEN GERD4HEINRICH JENS2GLOBALFOUNDRIES INC1GLOBOLFOUNDRIES INC1
Top patents by PatentIndex Score
27 records- 0188US6720264B2Prevention of precipitation defects on copper interconnects during CMP by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting propertiesADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 13, 2004·45 cites·15 claims
- 0288US6699107B2Polishing head and apparatus with an improved pad conditioner for chemical mechanical polishingADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 2, 2004·35 cites·34 claims
- 0386US8182709B2CMP system and method using individually controlled temperature zonesHEINRICH JENS·Filed 2008·Granted May 22, 2012·11 cites·18 claims
- 0483US8138038B2Superior fill conditions in a replacement gate approach by performing a polishing process based on a sacrificial fill materialHEINRICH JENS·Filed 2010·Granted Mar 20, 2012·8 cites·22 claims
- 0583US6184141B1Method for multiple phase polishing of a conductive layer in a semidonductor waferADVANCED MICRO DEVICES INC·Filed 1998·Granted Feb 6, 2001·64 cites·28 claims
- 0682US8183139B2Reduced defectivity in contacts of a semiconductor device comprising replacement gate electrode structures by using an intermediate cap layerMARXSEN GERD·Filed 2010·Granted May 22, 2012·8 cites·20 claims
- 0781US6595830B1Method of controlling chemical mechanical polishing operations to control erosion of insulating materialsADVANCED MICRO DEVICES INC·Filed 2001·Granted Jul 22, 2003·26 cites·26 claims
- 0878US8383500B2Semiconductor device formed by a replacement gate approach based on an early work function metalGLOBALFOUNDRIES INC·Filed 2010·Granted Feb 26, 2013·5 cites·20 claims
- 0978US6620726B1Method of forming metal lines having improved uniformity on a substrateADVANCED MICRO DEVICES INC·Filed 2002·Granted Sep 16, 2003·21 cites·57 claims
- 1076US7985329B2Technique for electrochemically depositing an alloy having a chemical orderADVANCED MICRO DEVICES INC·Filed 2005·Granted Jul 26, 2011·7 cites·15 claims
- 1172US6746958B1Method of controlling the duration of an endpoint polishing process in a multistage polishing processADVANCED MICRO DEVICES INC·Filed 2001·Granted Jun 8, 2004·19 cites·28 claims
- 1271US6761812B2Apparatus and method for electrochemical metal depositionADVANCED MICRO DEVICES INC·Filed 2002·Granted Jul 13, 2004·6 cites·15 claims
- 1364US8152595B2System and method for optical endpoint detection during CMP by using an across-substrate signalSCHLICKER MIKE·Filed 2009·Granted Apr 10, 2012·4 cites·24 claims
- 1461US6958247B2Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP processADVANCED MICRO DEVICES INC·Filed 2003·Granted Oct 25, 2005·10 cites·18 claims
- 1559US6752697B1Apparatus and method for chemical mechanical polishing of a substrateADVANCED MICRO DEVICES INC·Filed 2000·Granted Jun 22, 2004·8 cites·40 claims
- 1649US6774030B2Method and system for improving the manufacturing of metal damascene structuresADVANCED MICRO DEVICES INC·Filed 2002·Granted Aug 10, 2004·2 cites·18 claims
- 1741US7905764B2Polishing head using zone controlGLOBOLFOUNDRIES INC·Filed 2008·Granted Mar 15, 2011·0 cites·37 claims
- 1841US6957997B2Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditionerADVANCED MICRO DEVICES INC·Filed 2004·Granted Oct 25, 2005·2 cites·15 claims
- 1941US2008242196A1Method and system for controlling chemical mechanical polishing by taking zone specific substrate data into accountMARXSEN GERD·Filed 2007·Application pending·0 cites
- 2038US2010112816A1Method of reducing non-uniformities during chemical mechanical polishing of microstructure devices by using cmp pads in a glazed modeMARXSEN GERD·Filed 2009·Application pending·0 cites
- 2137US2004000234A1System and method for reducing the chemical reactivity of water and other chemicals used in the fabrication of integrated circuitsFiled 2002·Application pending·0 cites
- 2237US2004009670A1Apparatus and method for reducing oxidation of polished metal surfaces in a chemical mechanical polishing processFiled 2003·Application pending·0 cites
- 2336US2004063318A1Method of selectively removing metal residues from a dielectric layer by chemical mechanical polishingFiled 2003·Application pending·0 cites
- 2436US2004043611A1Method of reducing a defect level after chemically mechanically polishing a copper-containing substrate by rinsing the substrate with an oxidizing solutionFiled 2003·Application pending·0 cites
- 2535US2004123951A1Retaining ring having reduced wear and contamination rate for a polishing head of a CMP toolKRAMER JENS·Filed 2003·Application pending·0 cites
- 2634US7268000B2Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing stepADVANCED MICRO DEVICES INC·Filed 2002·Granted Sep 11, 2007·0 cites·29 claims
- 2732US2006172527A1Method for forming a defined recess in a damascene structure using a CMP process and a damascene structureMARXSEN GERD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →