Inventor · disambiguated record
Rashid Mavliev
Also filed as: MAVLIEV RASHID · MAVLIEV RASHID A
41 granted patents·15 pending applications·842 citations·filing 1998–2024
98Inventor score
Files withAPPLIED MATERIALS INC39MAVLIEV RASHID8ACHKIRE YOUNES1AIR LIQUIDE AMERICAN1BUTTERFIELD PAUL1
Top patents by PatentIndex Score
56 records- 0196US7422516B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2007·Granted Sep 9, 2008·42 cites·18 claims
- 0296US7278911B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Oct 9, 2007·33 cites·18 claims
- 0395US6962524B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Nov 8, 2005·80 cites·32 claims
- 0493US6979248B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2002·Granted Dec 27, 2005·42 cites·61 claims
- 0593US6710874B2Method and apparatus for detecting individual particles in a flowable sampleFiled 2002·Granted Mar 23, 2004·59 cites·36 claims
- 0693US6392745B1Method and apparatus for the fast detection of surface characteristicsAIR LIQUIDE AMERICAN·Filed 2000·Granted May 21, 2002·55 cites·27 claims
- 0792US7513062B2Single wafer dryer and drying methodsAPPLIED MATERIALS INC·Filed 2005·Granted Apr 7, 2009·23 cites·13 claims
- 0892US7452264B2Pad cleaning methodAPPLIED MATERIALS INC·Filed 2006·Granted Nov 18, 2008·18 cites·9 claims
- 0991US5903338ACondensation nucleus counter using mixing and coolingPARTICLE MEASURING SYST·Filed 1998·Granted May 11, 1999·139 cites·23 claims
- 1090US10241024B1System and method for characterization of inclusions in liquid samplesMAVLIEV RASHID·Filed 2017·Granted Mar 26, 2019·3 cites·20 claims
- 1190US7427340B2Conductive padAPPLIED MATERIALS INC·Filed 2005·Granted Sep 23, 2008·16 cites·17 claims
- 1290US6988942B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2004·Granted Jan 24, 2006·41 cites·18 claims
- 1390US6573836B1Method and apparatus for detecting the presence of powdered material in envelopesNEVMET CORP·Filed 2002·Granted Jun 3, 2003·78 cites·40 claims
- 1489US6955516B2Single wafer dryer and drying methodsAPPLIED MATERIALS INC·Filed 2002·Granted Oct 18, 2005·33 cites·20 claims
- 1588US7738101B2Systems and methods for in-line monitoring of particles in opaque flowsMAVLIEV RASHID·Filed 2008·Granted Jun 15, 2010·11 cites·26 claims
- 1686US7066800B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted Jun 27, 2006·31 cites·67 claims
- 1782US7137879B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Nov 21, 2006·7 cites·20 claims
- 1881US7104869B2Barrier removal at low polish pressureAPPLIED MATERIALS INC·Filed 2002·Granted Sep 12, 2006·26 cites·24 claims
- 1980US6821881B2Method for chemical mechanical polishing of semiconductor substratesAPPLIED MATERIALS INC·Filed 2002·Granted Nov 23, 2004·17 cites·6 claims
- 2080US2025069900A1Methods And Systems Of Forming Metal Interconnect Layers Using Engineered TemplatesMAVLIEV RASHID·Filed 2024·Application pending·0 cites
- 2179US7569134B2Contacts for electrochemical processingAPPLIED MATERIALS INC·Filed 2006·Granted Aug 4, 2009·5 cites·7 claims
- 2279US6869498B1Chemical mechanical polishing with shear force measurementAPPLIED MATERIALS INC·Filed 2003·Granted Mar 22, 2005·18 cites·16 claims
- 2378US12165881B2Methods and systems of forming metal interconnect layers using engineered templatesMAVLIEV RASHID·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 2475US7125477B2Contacts for electrochemical processingAPPLIED MATERIALS INC·Filed 2002·Granted Oct 24, 2006·14 cites·67 claims
- 2572US6991526B2Control of removal profile in electrochemically assisted CMPAPPLIED MATERIALS INC·Filed 2002·Granted Jan 31, 2006·14 cites·14 claims
- 2671US11756800B2Methods and systems of forming metal interconnect layers using engineered templatesMAVLIEV RASHID·Filed 2021·Granted Sep 12, 2023·0 cites·17 claims
- 2771US10705009B2System and method for characterization of inclusions in liquid samplesMAVLIEV RASHID·Filed 2019·Granted Jul 7, 2020·0 cites·20 claims
- 2871US7374644B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted May 20, 2008·13 cites·58 claims
- 2970US11125673B2System and method for characterization of inclusions in liquid samplesMAVLIEV RASHID·Filed 2020·Granted Sep 21, 2021·0 cites·20 claims
- 3070US7608173B2Biased retaining ringAPPLIED MATERIALS INC·Filed 2004·Granted Oct 27, 2009·12 cites·23 claims
- 3166US7344432B2Conductive pad with ion exchange membrane for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 18, 2008·3 cites·30 claims
- 3263US7520968B2Conductive pad design modification for better wafer-pad contactAPPLIED MATERIALS INC·Filed 2005·Granted Apr 21, 2009·1 cites·20 claims
- 3360US7815787B2Electrolyte retaining on a rotating platen by directional air flowAPPLIED MATERIALS INC·Filed 2008·Granted Oct 19, 2010·1 cites·20 claims
- 3460US7311592B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Dec 25, 2007·1 cites·17 claims
- 3558US2009241996A1Single wafer dryer and drying methodsACHKIRE YOUNES·Filed 2008·Application pending·0 cites
- 3655US7303662B2Contacts for electrochemical processingAPPLIED MATERIALS INC·Filed 2002·Granted Dec 4, 2007·4 cites·72 claims
- 3753US7375023B2Method and apparatus for chemical mechanical polishing of semiconductor substratesAPPLIED MATERIALS INC·Filed 2006·Granted May 20, 2008·0 cites·20 claims
- 3851US2006124474A1Method and apparatus for local polishing controlAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3950US7670468B2Contact assembly and method for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2005·Granted Mar 2, 2010·0 cites·18 claims
- 4050US2010231910A1Systems and methods for in-line monitoring of particles in opagque flowsMAVLIEV RASHID·Filed 2010·Application pending·0 cites
- 4149US2006180465A1Sliding flexible electrical contact for electrochemical processingAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 4249US2011053465A1Method and apparatus for local polishing controlTSAI STAN·Filed 2010·Application pending·0 cites
- 4349US2007295610A1Electrolyte retaining on a rotating platen by directional air flowAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4447US7407433B2Pad characterization toolAPPLIED MATERIALS INC·Filed 2006·Granted Aug 5, 2008·0 cites·18 claims
- 4547US7232363B2Polishing solution retainerAPPLIED MATERIALS INC·Filed 2004·Granted Jun 19, 2007·2 cites·35 claims
- 4647US2005173259A1Endpoint system for electro-chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 4746US7060606B2Method and apparatus for chemical mechanical polishing of semiconductor substratesAPPLIED MATERIALS INC·Filed 2004·Granted Jun 13, 2006·0 cites·22 claims
- 4844US2003168344A1Selective metal deposition for electrochemical platingAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 4944US2008156657A1Conductive polishing article for electrochemical mechanical polishingBUTTERFIELD PAUL D·Filed 2008·Application pending·0 cites
- 5043US7842169B2Method and apparatus for local polishing controlAPPLIED MATERIALS INC·Filed 2003·Granted Nov 30, 2010·0 cites·32 claims
Showing the top 50 of 56 patent records by PatentIndex Score.
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