Sliding flexible electrical contact for electrochemical processing

Abstract

Embodiments of a contact element for biasing a substrate during electrically assisted processing is provided herein. In one embodiment, the electrical contact includes a conductive base. At least one conductive flat spring is coupled to the base. A contact is coupled to each flat spring, the contact is suitable for slidably engaging a processed face of the substrate during processing.

1 . A contact element for biasing a substrate during electrically assisted processing, comprising: 
 a conductive base;    at least one conductive flat spring coupled to the base; and    a contact coupled to each flat spring, the contact suitable for slidably engaging a processed face of the substrate during processing.    
   
   
       2 . The contact element of  claim 1 , wherein the base further comprises a conductive coating disposed over a conductive or a non-conductive material.  
   
   
       3 . The contact element of  claim 1 , wherein the flat spring and the base are unitary, the flat spring being defined by one or more slots extending through the base and forming one or more flexible bridges in the base.  
   
   
       4 . The contact element of  claim 1 , wherein the flat spring is defined by a plurality of slots extending through the base, each slot forming a flexible bridge in the base, wherein the flexible bridges formed by the plurality of slots are not aligned with respect to each other.  
   
   
       5 . The contact element of  claim 1 , wherein the contact has a height above an upper surface of the base of from about 0.05 to about 0.2 inches and wherein the contact has a radius of from about 0.05 to about 0.2 inches.  
   
   
       6 . The contact element of  claim 1 , wherein the contact is formed from the same material as the flat spring and further comprises a coating.  
   
   
       7 . The contact element of  claim 1 , wherein the contact further comprises a ball disposed in an aperture formed in the flat spring.  
   
   
       8 . The contact element of  claim 7 , wherein the ball comprises a core having a coating formed thereon.  
   
   
       9 . The contact element of  claim 8 , wherein the core is plastic and the coating is a conductive material.  
   
   
       10 . The contact element of  claim 1 , further comprising a coating formed over the base, the flat spring, and the contact.  
   
   
       11 . The contact element of  claim 1 , further comprising a cover plate having an aperture aligned with the contact, wherein the upper portion of the contact extends from about 0.05 to about 0.2 inches above the cover plate.  
   
   
       12 . The contact element of  claim 1 , further comprising a holder coupled to a bottom surface of the base.  
   
   
       13 . The contact element of  claim 12 , wherein the holder further comprises a recess disposed beneath the flat spring and of sufficient size to allow the free deflection thereof.  
   
   
       14 . The contact element of  claim 12 , further comprising one or more apertures extending through the holder for the flow of a fluid therethrough.  
   
   
       15 . The contact element of  claim 1 , further comprising a plurality of flat springs formed by a plurality of slots through the base, wherein the contacts further comprise a ball disposed in an aperture formed in each of the plurality of flat springs, the ball comprising a plastic core having a conductive coating.  
   
   
       16 . The contact element of  claim 1 , further comprising at least 20 flat springs coupled to the base.  
   
   
       17 . The contact element of  claim 1 , further comprising at least 36 flat springs coupled to the base.  
   
   
       18 . A processing pad assembly for electrically assisted processing of a substrate, comprising: 
 a processing pad having a processing surface; and    a contact element laterally disposed with respect to the processing pad and having a portion thereof extending above the processing surface, the contact element comprising: 
 a conductive base;  
 at least one conductive flat spring coupled to the base; and  
 a contact coupled to each flat spring, the contact suitable for slidably engaging a processed face of the substrate during processing.  
   
   
   
       19 . The assembly of  claim 18 , wherein the flat spring and the base are unitary and wherein the flat spring is defined by one or more slots extending through the base, each slot forming a flexible bridge in the base.  
   
   
       20 . The assembly of  claim 18 , wherein the contact is formed from the same material as the flat spring and further comprises a coating.  
   
   
       21 . The assembly of  claim 18 , wherein the contact further comprises a ball disposed in an aperture formed in the flat spring.  
   
   
       22 . The assembly of  claim 18 , further comprising: 
 a cover plate having an aperture aligned with the contact, the cover plate having a thickness sufficient to cover a lower portion of the contact while leaving an upper portion of the contact exposed.    
   
   
       23 . The assembly of  claim 18 , further comprising: 
 a holder coupled to a bottom surface of the base, the holder having a recess disposed beneath the flat spring and of sufficient size to allow the free deflection thereof.    
   
   
       24 . The assembly of  claim 23 , further comprising one or more apertures extending through the holder for the flow of a fluid therethrough.  
   
   
       25 . The assembly of  claim 18 , further comprising: 
 an electrode disposed beneath the processing pad.    
   
   
       26 . An electrically assisted substrate processing system, comprising: 
 a platen;    a processing pad disposed on the platen and having a processing surface; and    a contact element laterally disposed with respect to the processing pad and having a portion thereof extending above the processing surface, the contact element comprising: 
 a conductive base;  
 at least one conductive flat spring coupled to the base; and  
 a contact coupled to each flat spring, the contact suitable for slidably engaging a processed face of the substrate during processing.  
   
   
   
       27 . The system of  claim 26 , wherein the flat spring and the base are unitary, the flat spring being defined by one or more slots extending through the base, each slot forming a flexible bridge in the base.  
   
   
       28 . The system of  claim 26 , wherein the contact further comprises a ball disposed in an aperture formed in the flat spring.  
   
   
       29 . The system of  claim 26 , further comprising: 
 a holder coupled to a bottom surface of the base, the holder having a recess disposed beneath the flat spring and of sufficient size to allow the free deflection thereof.    
   
   
       30 . The system of  claim 29 , further comprising one or more apertures extending through the holder for the flow of a fluid therethrough.  
   
   
       31 . The system of  claim 26 , further comprising: 
 an electrode disposed beneath the processing pad.