Inventor · disambiguated record
Mu-Seob Shin
Also filed as: SHIN MU-SEOB
2 granted patents·1 pending application·5 citations·filing 2008–2008
50Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0163US7812265B2Semiconductor package, printed circuit board, and electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 12, 2010·3 cites·17 claims
- 0256US8116088B2Semiconductor package and method of forming the same, and printed circuit boardSHIN MU-SEOB·Filed 2008·Granted Feb 14, 2012·2 cites·14 claims
- 0343US2008268579A1Semiconductor chip package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →