Assignee

SHIN MU-SEOB

KR·1 granted patent·2 citations·filing 2008–2008

Technology mixH10W1

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1 record

0156US8116088B2Semiconductor package and method of forming the same, and printed circuit boardSHIN MU-SEOB·Filed 2008·Granted Feb 14, 2012·2 cites·14 claims

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