Inventor · disambiguated record
Takayuki Iwaki
Also filed as: IWAKI TAKAYUKI
17 granted patents·3 pending applications·243 citations·filing 2000–2019
92Inventor score
Files withNEC ELECTRONICS CORP5MICRON TECHNOLOGY INC4KOITO MFG CO LTD3RENESAS ELECTRONICS CORP3IWAKI TAKAYUKI2
Top patents by PatentIndex Score
20 records- 0198US7294534B2Interconnect layout methodNEC ELECTRONICS CORP·Filed 2005·Granted Nov 13, 2007·194 cites·16 claims
- 0282US10607998B1Integrated circuitry, DRAM circuitry, method of forming a plurality of conductive vias, and method of forming DRAM circuitryMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 31, 2020·3 cites·27 claims
- 0380US10847651B2Semiconductor devices including electrically conductive contacts and related systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 24, 2020·3 cites·23 claims
- 0474US11152371B2Apparatus comprising monocrystalline semiconductor materials and monocrystalline metal silicide materials, and related methods, electronic devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 19, 2021·1 cites·25 claims
- 0573US7691758B2Method of forming insulating film and method of manufacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Granted Apr 6, 2010·4 cites·7 claims
- 0673US7350948B2Vehicle headlampKOITO MFG CO LTD·Filed 2006·Granted Apr 1, 2008·9 cites·10 claims
- 0769US8368176B2Semiconductor device and method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2011·Granted Feb 5, 2013·2 cites·9 claims
- 0867US10840249B2Integrated circuitry constructionsMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 17, 2020·1 cites·27 claims
- 0962US7956461B2Semiconductor apparatus including semiconductor chip with stress material selectively provided in region of wiring layerRENESAS ELECTRONICS CORP·Filed 2008·Granted Jun 7, 2011·2 cites·15 claims
- 1059US6354718B1Vehicular headlamp having improved low-beam light distribution patternKOITO MFG CO LTD·Filed 2000·Granted Mar 12, 2002·8 cites·12 claims
- 1157US8237208B2Semiconductor device including hydrogen barrier film for covering metal-insulator-meal capacitor and method of manufacturing the sameIWAKI TAKAYUKI·Filed 2008·Granted Aug 7, 2012·2 cites·20 claims
- 1257US7642155B2Semiconductor device with metal nitride barrier layer between gate dielectric and silicided, metallic gate electrodesNEC ELECTRONICS CORP·Filed 2006·Granted Jan 5, 2010·1 cites·7 claims
- 1352USD503004SVehicle fog lampNORTH AMERICAN LIGHTING INC·Filed 2003·Granted Mar 15, 2005·9 cites·1 claims
- 1451US6695466B2HeadlampKOITO MFG CO LTD·Filed 2001·Granted Feb 24, 2004·4 cites·4 claims
- 1549US8946044B2Semiconductor device and method of manufacturing semiconductor deviceRENESAS ELECRONICS CORP·Filed 2012·Granted Feb 3, 2015·0 cites·14 claims
- 1648US2013001745A1Semiconductor device, lower layer wiring designing device, method of designing lower layer wiring and computer programRENESAS ELECTRONICS CORP·Filed 2012·Application pending·0 cites
- 1744US2008157286A1Semiconductor device having a indicator indicating cleavage directionNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 1842US8288840B2Semiconductor device with lower layer wiringIWAKI TAKAYUKI·Filed 2010·Granted Oct 16, 2012·0 cites·13 claims
- 1936US2010270643A1Semiconductor device and layout method thereforNEC ELECTRONICS CORP·Filed 2010·Application pending·0 cites
- 2033US9448234B2Therapeutic agent for preterm delivery or abortion using plasminogen activator inhibitor-1NAT UNIV CORP HAMAMATSU UNIV SCHOOL OF MEDICINE·Filed 2012·Granted Sep 20, 2016·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →