Inventor · disambiguated record
Paul A. Lauro
Also filed as: LAURO PAUL · LAURO PAUL A · LAURO PAUL ALFRED
124 granted patents·66 pending applications·6,449 citations·filing 1989–2020
99Inventor score
Top patents by PatentIndex Score
190 records- 0199US8987132B2Double solder bumps on substrates for low temperature flip chip bondingIBM·Filed 2014·Granted Mar 24, 2015·76 cites·2 claims
- 0299US6708403B2Angled flying lead wire bonding processIBM·Filed 2003·Granted Mar 23, 2004·194 cites·31 claims
- 0399US6526655B2Angled flying lead wire bonding processIBM·Filed 2001·Granted Mar 4, 2003·188 cites·26 claims
- 0499US6334247B1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 1997·Granted Jan 1, 2002·277 cites·80 claims
- 0599US5821763ATest probe for high density integrated circuits, methods of fabrication thereof and methods of use thereofIBM·Filed 1996·Granted Oct 13, 1998·349 cites·13 claims
- 0699US5635846ATest probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformerIBM·Filed 1993·Granted Jun 3, 1997·342 cites·7 claims
- 0799US5371654AThree dimensional high performance interconnection packageIBM·Filed 1992·Granted Dec 6, 1994·503 cites·25 claims
- 0898US8247261B2Thin substrate fabrication using stress-induced substrate spallingBEDELL STEPHEN W·Filed 2010·Granted Aug 21, 2012·55 cites·8 claims
- 0998US7978473B2Cooling apparatus with cold plate formed in situ on a surface to be cooledIBM·Filed 2010·Granted Jul 12, 2011·68 cites·20 claims
- 1098US6300780B1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 1998·Granted Oct 9, 2001·197 cites·17 claims
- 1198US6206273B1Structures and processes to create a desired probetip contact geometry on a wafer test probeIBM·Filed 1999·Granted Mar 27, 2001·206 cites·9 claims
- 1298US5531022AMethod of forming a three dimensional high performance interconnection packageIBM·Filed 1994·Granted Jul 2, 1996·328 cites·15 claims
- 1397US8828860B2Double solder bumps on substrates for low temperature flip chip bondingGRUBER PETER A·Filed 2012·Granted Sep 9, 2014·30 cites·23 claims
- 1497US7495342B2Angled flying lead wire bonding processIBM·Filed 2003·Granted Feb 24, 2009·109 cites·29 claims
- 1597US6332270B2Method of making high density integral test probeIBM·Filed 1998·Granted Dec 25, 2001·231 cites·12 claims
- 1697US6295729B1Angled flying lead wire bonding processIBM·Filed 1998·Granted Oct 2, 2001·206 cites·8 claims
- 1797US6062879AHigh density test probe with rigid surface structureIBM·Filed 1998·Granted May 16, 2000·150 cites·7 claims
- 1897US5810607AInterconnector with contact pads having enhanced durabilityIBM·Filed 1995·Granted Sep 22, 1998·244 cites·18 claims
- 1997US5785538AHigh density test probe with rigid surface structureIBM·Filed 1996·Granted Jul 28, 1998·147 cites·17 claims
- 2096US9570295B1Protective capping layer for spalled gallium nitrideIBM·Filed 2016·Granted Feb 14, 2017·10 cites·20 claims
- 2196US8450184B2Thin substrate fabrication using stress-induced spallingBEDELL STEPHEN W·Filed 2012·Granted May 28, 2013·17 cites·9 claims
- 2296US7736152B2Land grid array fabrication using elastomer core and conducting metal shell or meshIBM·Filed 2008·Granted Jun 15, 2010·37 cites·1 claims
- 2396US7538565B1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 1999·Granted May 26, 2009·112 cites·40 claims
- 2496US5811982AHigh density cantilevered probe for electronic devicesIBM·Filed 1996·Granted Sep 22, 1998·310 cites·13 claims
- 2595US9748353B2Method of making a gallium nitride deviceIBM·Filed 2015·Granted Aug 29, 2017·9 cites·15 claims
- 2695US7731079B2Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooledIBM·Filed 2008·Granted Jun 8, 2010·31 cites·9 claims
- 2795US6722032B2Method of forming a structure for electronic devices contact locationsIBM·Filed 2001·Granted Apr 20, 2004·79 cites·16 claims
- 2895US6528984B2Integrated compliant probe for wafer level test and burn-inIBM·Filed 1997·Granted Mar 4, 2003·178 cites·12 claims
- 2995US6054651AFoamed elastomers for wafer probing applications and interposer connectorsIBM·Filed 1996·Granted Apr 25, 2000·128 cites·7 claims
- 3094US6329827B1High density cantilevered probe for electronic devicesIBM·Filed 1998·Granted Dec 11, 2001·107 cites·22 claims
- 3194US5185073AMethod of fabricating nendritic materialsIBM·Filed 1991·Granted Feb 9, 1993·173 cites·4 claims
- 3293US8162200B2Micro-fluidic injection molded solder (IMS)BUCHWALTER STEPHEN L·Filed 2011·Granted Apr 24, 2012·12 cites·8 claims
- 3393US7931187B2Injection molded solder method for forming solder bumps on substratesIBM·Filed 2008·Granted Apr 26, 2011·16 cites·16 claims
- 3493US7351360B2Self orienting micro plates of thermally conducting material as component in thermal paste or adhesiveIBM·Filed 2004·Granted Apr 1, 2008·33 cites·15 claims
- 3593US6452406B1Probe structure having a plurality of discrete insulated probe tipsIBM·Filed 1997·Granted Sep 17, 2002·111 cites·28 claims
- 3693US6286208B1Interconnector with contact pads having enhanced durabilityIBM·Filed 1996·Granted Sep 11, 2001·124 cites·5 claims
- 3793US6078500APluggable chip scale packageIBM·Filed 1998·Granted Jun 20, 2000·149 cites·6 claims
- 3892US8709914B2Method for controlled layer transferBEDELL STEPHEN W·Filed 2011·Granted Apr 29, 2014·13 cites·24 claims
- 3992US5914614AHigh density cantilevered probe for electronic devicesIBM·Filed 1997·Granted Jun 22, 1999·130 cites·8 claims
- 4091US8156998B2Patterned metal thermal interfaceFURMAN BRUCE K·Filed 2010·Granted Apr 17, 2012·12 cites·18 claims
- 4191US6104201AMethod and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltageIBM·Filed 1998·Granted Aug 15, 2000·82 cites·10 claims
- 4291US5137461ASeparable electrical connection technologyIBM·Filed 1990·Granted Aug 11, 1992·134 cites·8 claims
- 4390US7980446B2Micro-fluidic injection molded solder (IMS)INTERNAT BUSINSS MACHINES CORP·Filed 2009·Granted Jul 19, 2011·10 cites·20 claims
- 4490US7694719B2Patterned metal thermal interfaceIBM·Filed 2007·Granted Apr 13, 2010·18 cites·16 claims
- 4590US7368924B2Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereofIBM·Filed 2002·Granted May 6, 2008·34 cites·47 claims
- 4689US8523046B1Forming an array of metal balls or shapes on a substrateIBM·Filed 2012·Granted Sep 3, 2013·8 cites·11 claims
- 4789US8492262B2Direct IMS (injection molded solder) without a mask for forming solder bumps on substratesGRUBER PETER A·Filed 2010·Granted Jul 23, 2013·11 cites·9 claims
- 4889US8003512B2Structure of UBM and solder bumps and methods of fabricationIBM·Filed 2009·Granted Aug 23, 2011·19 cites·19 claims
- 4988US8936961B2Removal of stressor layer from a spalled layer and method of making a bifacial solar cell using the sameBEDELL STEPHEN W·Filed 2012·Granted Jan 20, 2015·7 cites·25 claims
- 5088US8748296B2Edge-exclusion spalling method for improving substrate reusabilityBEDELL STEPHEN W·Filed 2011·Granted Jun 10, 2014·8 cites·23 claims
Showing the top 50 of 190 patent records by PatentIndex Score.
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