Inventor · disambiguated record
Teruhiko Kumada
Also filed as: KUMADA TERUHIKO
21 granted patents·11 pending applications·107 citations·filing 1990–2015
94Inventor score
Files withMITSUBISHI ELECTRIC CORP14KUMADA TERUHIKO4YOSHIDA YASUHIRO3RENESAS TECH CORP2SAMEJIMA SOHEI2
Top patents by PatentIndex Score
32 records- 0184US6924240B2Low dielectric constant material, insulating film comprising the low dielectric constant material, and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Aug 2, 2005·24 cites·18 claims
- 0283US8448697B2Coating composition, heat exchanger, and air-conditionerMORIOKA REIJI·Filed 2009·Granted May 28, 2013·6 cites·17 claims
- 0370US8846148B2Composition for chemical vapor deposition film-formation and method for production of low dielectric constant filmKUMADA TERUHIKO·Filed 2006·Granted Sep 30, 2014·4 cites·4 claims
- 0468US8134085B2Printed interconnection board having a core including carbon fiber reinforced plasticSAMEJIMA SOHEI·Filed 2008·Granted Mar 13, 2012·4 cites·8 claims
- 0567US8801850B2Coating composition, and its production, heat exchanger and air conditionerYOSHIDA YASUHIRO·Filed 2008·Granted Aug 12, 2014·3 cites·15 claims
- 0667US5100762ARadiation-sensitive polymer and radiation-sensitive composition containing the sameMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Mar 31, 1992·22 cites·90 claims
- 0766US8288294B2Insulating film for semiconductor device, process and apparatus for producing insulating film for semiconductor device, semiconductor device, and process for producing the semiconductor deviceKAFUKU HIDETAKA·Filed 2009·Granted Oct 16, 2012·4 cites·14 claims
- 0863US7671473B2Semiconductor device and method of fabricating the sameRENESAS TECH CORP·Filed 2006·Granted Mar 2, 2010·2 cites·20 claims
- 0960US9313903B2Method of manufacturing printed wiring boardSAMEJIMA SOHEI·Filed 2009·Granted Apr 12, 2016·1 cites·3 claims
- 1060US8404314B2Plasma CVD apparatus, method for forming thin film and semiconductor deviceKUMADA TERUHIKO·Filed 2007·Granted Mar 26, 2013·1 cites·3 claims
- 1159US8043678B2Radome and method of producing the sameMITSUBISHI ELECTRIC CORP·Filed 2008·Granted Oct 25, 2011·3 cites·8 claims
- 1258US5204218APhotosensitive resin compositionMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Apr 20, 1993·15 cites·23 claims
- 1354US9481802B2Coating composition, coating method, air conditioner, ventilation fan, and electrical equipmentYAMAMOTO YOSHINORI·Filed 2010·Granted Nov 1, 2016·0 cites·10 claims
- 1454US7824784B2Composition for low dielectric material, low dielectric material and method for production thereofMITSUBISHI ELECTRIC CORP·Filed 2008·Granted Nov 2, 2010·0 cites·7 claims
- 1554US6511792B2Developing process, process for forming pattern and process for preparing semiconductor device using sameMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jan 28, 2003·7 cites·14 claims
- 1653US8674046B2Source material for preparing low dielectric constant materialNOBUTOKI HIDEHARU·Filed 2009·Granted Mar 18, 2014·0 cites·2 claims
- 1753US8148647B2Printed circuit board and method of manufacturing the sameSAMEJIMA SOUHEI·Filed 2007·Granted Apr 3, 2012·2 cites·4 claims
- 1851US7030007B2Via-filling material and process for fabricating semiconductor integrated circuit using the materialMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Apr 18, 2006·3 cites·6 claims
- 1951US2016066431A1Method of manufacturing printed wiring boardMITSUBISHI ELECTRIC CORP·Filed 2015·Application pending·0 cites
- 2050US2012073628A1Coating agent for solar cell module, and solar cell module and production method for the solar cell moduleYOSHIDA YASUHIRO·Filed 2010·Application pending·0 cites
- 2149US2005181628A1Process for preparing low dielectric constant materialMITSUBISHI ELECTRIC CORP·Filed 2005·Application pending·0 cites
- 2248US2013160711A1Plasma cvd apparatus, method for forming thin film and semiconductor deviceKUMADA TERUHIKO·Filed 2013·Application pending·0 cites
- 2348US2008029027A1Plasma Cvd DeviceMITSUBISHI ELECTRIC CORP·Filed 2005·Application pending·0 cites
- 2448US2008038585A1Process for Film Production and Semiconductor Device Utilizing Film Produced by the ProcessMITSUBISHI ELECTRIC CORP·Filed 2005·Application pending·0 cites
- 2545US7981790B2Semiconductor device and method of fabricating the sameRENESAS ELECTRONICS CORP·Filed 2010·Granted Jul 19, 2011·0 cites·6 claims
- 2645US2010181654A1Manufacturing method of semiconductor device, insulating film for semiconductor device, and manufacturing apparatus of the sameMITSUBISHI HEAVY IND LTD·Filed 2009·Application pending·0 cites
- 2743US2007128559A1Material for forming fine pattern, method of forming fine pattern, method of manufacturing electronic device using the same, and electronic device manufactured from the sameRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 2841US2011300370A1Coating method and coated articleYOSHIDA YASUHIRO·Filed 2010·Application pending·0 cites
- 2939US2005282015A1Composition for low dielectric material, low dielectric material and method for production thereofKUMADA TERUHIKO·Filed 2004·Application pending·0 cites
- 3034US6984473B2Method of patterning a mask blankMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Jan 10, 2006·0 cites·5 claims
- 3133US5981146AResist coating filmMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Nov 9, 1999·6 cites·5 claims
- 3233US2002196896A1Exposure method, exposure apparatus, X-ray mask, semiconductor device and microstructureMITSUBISHI ELECTRIC CORP·Filed 2001·Application pending·0 cites
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