Method of manufacturing printed wiring board

Abstract

A method of manufacturing a printed wiring board ( 10 ) includes the steps of: forming a core including carbon fiber reinforced plastic having a primary through hole ( 3 a ); forming a first adhesive member ( 4 a ) on a lower surface of the core to cover the primary through hole ( 3 a ); charging an insulating member into the primary through hole ( 3 a ); forming a second adhesive member ( 4 b ) on an upper surface of the core; forming a third adhesive member ( 6 a ) below the first adhesive member ( 4 a ); forming a fourth adhesive member ( 6 b ) on the second adhesive member ( 4 b ); and forming interconnections on the core.

1 . A method of manufacturing a printed wiring board, comprising the steps of:
 forming a core including carbon fiber reinforced plastic having a primary through hole ( 3   a );   providing a bottom of said primary through hole by forming a first adhesive member on a lower surface of said core to cover said primary through hole;   charging an insulating member into said primary through hole by screen printing;   forming a second adhesive member on said insulating member on an upper surface of said core; and   forming interconnections on said core,   wherein the insulating member is charged after formation of the first adhesive member and before formation of the second adhesive member.   
     
     
         2 . The method of manufacturing a printed wiring board according to  claim 1 , further comprising the steps of:
 forming a third adhesive member below said first adhesive member; and   forming a fourth adhesive member on said second adhesive member.   
     
     
         3 . The method of manufacturing a printed wiring board according to  claim 2 , wherein said third and fourth adhesive members include glass cloth. 
     
     
         4 . The method of manufacturing a printed circuit board according to  claim 1 , wherein said insulating member includes an inorganic filler and resin, said resin being selected from a group consisting of epoxy, bismaleimide, cyanate ester, and polyimide, and wherein said insulating member has a thermal conductivity of 1 to 15 W/(m·K). 
     
     
         5 . The method of manufacturing a printed wiring board according to  claim 1 , wherein said step of forming said first adhesive member includes the step of forming a coating layer to coat a wall surface of said primary through hole.