Inventor · disambiguated record
Robert Steger
Also filed as: STEGER ROBERT · STEGER ROBERT J
48 granted patents·8 pending applications·3,835 citations·filing 1990–2021
99Inventor score
Files withLAM RES CORP29APPLIED MATERIALS INC22BENJAMIN NEIL2LAM RES CORP A DELAWARE CORP1LAM RES INC A DELAWARE CORP1
Top patents by PatentIndex Score
56 records- 0199US6847014B1Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece supportLAM RES CORP·Filed 2002·Granted Jan 25, 2005·704 cites·23 claims
- 0298US7274004B2Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece supportLAM RES CORP·Filed 2004·Granted Sep 25, 2007·170 cites·8 claims
- 0397US7161121B1Electrostatic chuck having radial temperature control capabilityLAM RES CORP·Filed 2005·Granted Jan 9, 2007·53 cites·21 claims
- 0497US6896765B2Method and apparatus for the compensation of edge ring wear in a plasma processing chamberLAM RES CORP·Filed 2002·Granted May 24, 2005·77 cites·15 claims
- 0597US6805952B2Low contamination plasma chamber components and methods for making the sameLAM RES CORP·Filed 2000·Granted Oct 19, 2004·135 cites·21 claims
- 0697US6170428B1Symmetric tunable inductively coupled HDP-CVD reactorAPPLIED MATERIALS INC·Filed 1996·Granted Jan 9, 2001·430 cites·26 claims
- 0797US6108189AElectrostatic chuck having improved gas conduitsAPPLIED MATERIALS INC·Filed 1997·Granted Aug 22, 2000·255 cites·64 claims
- 0897US5788799AApparatus and method for cleaning of semiconductor process chamber surfacesAPPLIED MATERIALS INC·Filed 1996·Granted Aug 4, 1998·305 cites·35 claims
- 0996US7718932B2Electrostatic chuck having radial temperature control capabilityLAM RES CORP·Filed 2006·Granted May 18, 2010·28 cites·20 claims
- 1096US6770852B1Critical dimension variation compensation across a wafer by means of local wafer temperature controlLAM RES CORP·Filed 2003·Granted Aug 3, 2004·102 cites·17 claims
- 1196US6721162B2Electrostatic chuck having composite dielectric layer and method of manufactureAPPLIED MATERIALS INC·Filed 2002·Granted Apr 13, 2004·76 cites·20 claims
- 1294US6632322B1Switched uniformity controlLAM RES CORP·Filed 2000·Granted Oct 14, 2003·46 cites·30 claims
- 1394US6444083B1Corrosion resistant component of semiconductor processing equipment and method of manufacturing thereofLAM RES CORP·Filed 1999·Granted Sep 3, 2002·130 cites·22 claims
- 1494US6414834B1Dielectric covered electrostatic chuckAPPLIED MATERIALS INC·Filed 2000·Granted Jul 2, 2002·56 cites·34 claims
- 1594US5720818AConduits for flow of heat transfer fluid to the surface of an electrostatic chuckAPPLIED MATERIALS INC·Filed 1996·Granted Feb 24, 1998·150 cites·51 claims
- 1693US7869184B2Method of determining a target mesa configuration of an electrostatic chuckLAM RES CORP·Filed 2005·Granted Jan 11, 2011·19 cites·17 claims
- 1793US7223321B1Faraday shield disposed within an inductively coupled plasma etching apparatusLAM RES CORP·Filed 2002·Granted May 29, 2007·40 cites·28 claims
- 1892US5522131AElectrostatic chuck having a grooved surfaceAPPLIED MATERIALS INC·Filed 1995·Granted Jun 4, 1996·120 cites·26 claims
- 1990US5085727APlasma etch apparatus with conductive coating on inner metal surfaces of chamber to provide protection from chemical corrosionAPPLIED MATERIALS INC·Filed 1990·Granted Feb 4, 1992·83 cites·14 claims
- 2089US7501605B2Method of tuning thermal conductivity of electrostatic chuck support assemblyLAM RES CORP·Filed 2006·Granted Mar 10, 2009·12 cites·18 claims
- 2189US7176403B2Method and apparatus for the compensation of edge ring wear in a plasma processing chamberLAM RES CORP·Filed 2004·Granted Feb 13, 2007·27 cites·29 claims
- 2288US9824904B2Method and apparatus for controlling spatial temperature distributionLAM RES CORP·Filed 2015·Granted Nov 21, 2017·4 cites·18 claims
- 2388US5730803AApparatus and method for transferring heat from a hot electrostatic chuck to an underlying cold bodyAPPLIED MATERIALS INC·Filed 1996·Granted Mar 24, 1998·102 cites·33 claims
- 2488US5292399APlasma etching apparatus with conductive means for inhibiting arcingAPPLIED MATERIALS INC·Filed 1992·Granted Mar 8, 1994·123 cites·33 claims
- 2587US8963052B2Method for controlling spatial temperature distribution across a semiconductor waferBENJAMIN NEIL·Filed 2009·Granted Feb 24, 2015·9 cites·20 claims
- 2686US7939784B2Electrostatic chuck support assemblyLAM RES CORP·Filed 2009·Granted May 10, 2011·8 cites·19 claims
- 2786US5494523AControlling plasma particulates by contouring the plasma sheath using materials of differing RF impedancesAPPLIED MATERIALS INC·Filed 1995·Granted Feb 27, 1996·53 cites·4 claims
- 2885US7648582B2Cleaning of electrostatic chucks using ultrasonic agitation and applied electric fieldsLAM RES CORP·Filed 2005·Granted Jan 19, 2010·7 cites·19 claims
- 2984US7993460B2Substrate support having dynamic temperature controlLAM RES CORP·Filed 2003·Granted Aug 9, 2011·26 cites·14 claims
- 3083US5100502ASemiconductor wafer transfer in processing systemsAPPLIED MATERIALS INC·Filed 1990·Granted Mar 31, 1992·89 cites·19 claims
- 3181US7480974B2Methods of making gas distribution members for plasma processing apparatusesLAM RES CORP·Filed 2005·Granted Jan 27, 2009·6 cites·17 claims
- 3281US5904776AConduits for flow of heat transfer fluid to the surface of an electrostatic chuckAPPLIED MATERIALS INC·Filed 1997·Granted May 18, 1999·52 cites·12 claims
- 3380US8921740B2Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece supportLAM RES CORP·Filed 2013·Granted Dec 30, 2014·3 cites·13 claims
- 3477US7152011B2Smart component-based management techniques in a substrate processing systemLAM RES CORP·Filed 2004·Granted Dec 19, 2006·9 cites·49 claims
- 3575US6952255B2System and method for integrated multi-use optical alignmentLAM RES CORP·Filed 2003·Granted Oct 4, 2005·18 cites·21 claims
- 3675US5308417AUniformity for magnetically enhanced plasma chambersAPPLIED MATERIALS INC·Filed 1991·Granted May 3, 1994·63 cites·14 claims
- 3775US5268200AMethod of forming plasma etch apparatus with conductive coating on inner metal surfaces of chamber to provide protection from chemical corrosionAPPLIED MATERIALS INC·Filed 1991·Granted Dec 7, 1993·28 cites·4 claims
- 3873US6976782B1Methods and apparatus for in situ substrate temperature monitoringLAM RES CORP·Filed 2003·Granted Dec 20, 2005·15 cites·49 claims
- 3971US6858265B2Technique for improving chucking reproducibilityAPPLIED MATERIALS INC·Filed 2003·Granted Feb 22, 2005·13 cites·14 claims
- 4071US5534108AMethod and apparatus for altering magnetic coil current to produce etch uniformity in a magnetic field-enhanced plasma reactorAPPLIED MATERIALS INC·Filed 1995·Granted Jul 9, 1996·52 cites·28 claims
- 4171US5356486ACombined wafer support and temperature monitoring deviceAPPLIED MATERIALS INC·Filed 1991·Granted Oct 18, 1994·46 cites·15 claims
- 4269US8536494B2Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece supportBENJAMIN NEIL·Filed 2004·Granted Sep 17, 2013·9 cites·15 claims
- 4369US5715132AMethod and structure for improving gas breakdown resistance and reducing the potential of arcing in an electrostatic chuckAPPLIED MATERIALS INC·Filed 1996·Granted Feb 3, 1998·30 cites·15 claims
- 4468US5644467AMethod and structure for improving gas breakdown resistance and reducing the potential of arcing in a electrostatic chuckAPPLIED MATERIALS INC·Filed 1995·Granted Jul 1, 1997·30 cites·23 claims
- 4566US8747559B2Substrate support having dynamic temperature controlSTEGER ROBERT J·Filed 2011·Granted Jun 10, 2014·2 cites·10 claims
- 4660US7282454B2Switched uniformity controlLAM RES CORP·Filed 2003·Granted Oct 16, 2007·3 cites·10 claims
- 4760US7254510B2Smart component-based management techniques in a substrate processing systemLAM RES CORP·Filed 2006·Granted Aug 7, 2007·0 cites·17 claims
- 4857US2007181257A1Faraday Shield Disposed Within An Inductively Coupled Plasma Etching apparatusLAM RES CORP·Filed 2007·Application pending·0 cites
- 4955US2009120583A1Methods of making gas distribution members for plasma processing apparatusesLAM RES CORP·Filed 2009·Application pending·0 cites
- 5048US5567909AMethod for supporting a wafer in a combined wafer support and temperature monitoring deviceAPPLIED MATERIALS INC·Filed 1994·Granted Oct 22, 1996·17 cites·4 claims
Showing the top 50 of 56 patent records by PatentIndex Score.
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