Inventor · disambiguated record
Andrew N. Sawle
Also filed as: SAWLE ANDREW · SAWLE ANDREW N · SAWLE ANDREW NEIL
34 granted patents·3 pending applications·140 citations·filing 2002–2022
96Inventor score
Files withINT RECTIFIER CORP13INFINEON TECHNOLOGIES AMERICAS CORP11INFINEON TECHNOLOGIES AUSTRIA AG4CHO EUNG SAN3PAVIER MARK2
Top patents by PatentIndex Score
37 records- 0196US8426952B2Stacked half-bridge package with a common conductive leadframeCHO EUNG SAN·Filed 2011·Granted Apr 23, 2013·25 cites·20 claims
- 0295US9583477B2Stacked half-bridge packageINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2016·Granted Feb 28, 2017·10 cites·20 claims
- 0393US9349677B2Stacked half-bridge package with a common leadframeINT RECTIFIER CORP·Filed 2013·Granted May 24, 2016·12 cites·20 claims
- 0489US9159703B2Power converter package including vertically stacked driver ICINT RECTIFIER CORP·Filed 2013·Granted Oct 13, 2015·8 cites·14 claims
- 0585US8674497B2Stacked half-bridge package with a current carrying layerCHO EUNG SAN·Filed 2011·Granted Mar 18, 2014·6 cites·20 claims
- 0684US7285866B2Surface mounted package with die bottom spaced from support boardINT RECTIFIER CORP·Filed 2005·Granted Oct 23, 2007·10 cites·25 claims
- 0782US9269655B2Method for fabricating a semiconductor package with conductive carrier integrated heat spreaderINT RECTIFIER CORP·Filed 2015·Granted Feb 23, 2016·3 cites·20 claims
- 0882US8860194B2Buck converter power packageMA LING·Filed 2012·Granted Oct 14, 2014·8 cites·21 claims
- 0981US8680627B2Stacked half-bridge package with a common conductive clipCHO EUNG SAN·Filed 2011·Granted Mar 25, 2014·4 cites·20 claims
- 1081US7402507B2Semiconductor package fabricationINT RECTIFIER CORP·Filed 2006·Granted Jul 22, 2008·12 cites·22 claims
- 1179US11996771B2Power semiconductor system having an inductor module attached to a power stage moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted May 28, 2024·0 cites·14 claims
- 1275US6930397B2Surface mounted package with die bottom spaced from support boardINT RECTIFIER CORP·Filed 2002·Granted Aug 16, 2005·18 cites·14 claims
- 1373US9111921B2Semiconductor package with conductive carrier integrated heat spreaderINT RECTIFIER CORP·Filed 2013·Granted Aug 18, 2015·2 cites·14 claims
- 1472US11539291B2Method of manufacturing a power semiconductor systemINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Dec 27, 2022·0 cites·6 claims
- 1570US10833583B2Methods of manufacturing inductor modules and power semiconductor systems having inductor modulesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Nov 10, 2020·0 cites·18 claims
- 1666US9299690B2Method for fabricating a power semiconductor package including vertically stacked driver ICINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2015·Granted Mar 29, 2016·1 cites·11 claims
- 1765US8143729B2Autoclave capable chip-scale packagePAVIER MARK·Filed 2009·Granted Mar 27, 2012·4 cites·20 claims
- 1863US7968984B2Universal pad arrangement for surface mounted semiconductor devicesINT RECTIFIER CORP·Filed 2006·Granted Jun 28, 2011·2 cites·14 claims
- 1962US8368211B2Solderable top metalization and passivation for source mounted packageINT RECTIFIER CORP·Filed 2004·Granted Feb 5, 2013·9 cites·20 claims
- 2061US9397212B2Power converter package including top-drain configured power FETINT RECTIFIER CORP·Filed 2013·Granted Jul 19, 2016·1 cites·20 claims
- 2159US8125083B2Protective barrier layer for semiconductor device electrodesCARROLL MARTIN·Filed 2006·Granted Feb 28, 2012·2 cites·13 claims
- 2258US10601314B2Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modulesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Mar 24, 2020·0 cites·13 claims
- 2357US9048230B2Half-bridge package with a conductive clipINT RECTIFIER CORP·Filed 2014·Granted Jun 2, 2015·0 cites·20 claims
- 2456US10103076B2Semiconductor package including a semiconductor die having redistributed padsINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2017·Granted Oct 16, 2018·0 cites·8 claims
- 2556US9601418B2Stacked half-bridge packageINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2014·Granted Mar 21, 2017·0 cites·20 claims
- 2656US8466546B2Chip-scale packageFARLOW ANDY·Filed 2006·Granted Jun 18, 2013·3 cites·19 claims
- 2755US2018366380A1Semiconductor package including a semiconductor die having redistributed padsINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2018·Application pending·0 cites
- 2854US9673109B2Method for fabricating a semiconductor package with conductive carrier integrated heat spreaderINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2016·Granted Jun 6, 2017·0 cites·20 claims
- 2954US9461022B2Power semiconductor package with a common conductive clipINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2015·Granted Oct 4, 2016·0 cites·20 claims
- 3053US9502395B2Power semiconductor package having vertically stacked driver ICINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2015·Granted Nov 22, 2016·0 cites·12 claims
- 3151US9852939B2Solderable contact and passivation for semiconductor diesINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2013·Granted Dec 26, 2017·0 cites·15 claims
- 3251US9852940B2Method for forming a reliable solderable contactINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2013·Granted Dec 26, 2017·0 cites·18 claims
- 3350US9633951B2Semiconductor package including a semiconductor die having redistributed padsPAVIER MARK·Filed 2006·Granted Apr 25, 2017·0 cites·15 claims
- 3446US9576887B2Semiconductor package including conductive carrier coupled power switchesINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2013·Granted Feb 21, 2017·0 cites·20 claims
- 3543US7417312B2Use of solder paste for heat dissipationINT RECTIFIER CORP·Filed 2006·Granted Aug 26, 2008·0 cites·13 claims
- 3643US2007158796A1Semiconductor packageINT RECTIFIER CORP·Filed 2006·Application pending·0 cites
- 3738US2005269677A1Preparation of front contact for surface mountingSTANDING MARTIN·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →