Inventor · disambiguated record
Neil Mclellan
Also filed as: MCLELLAN NEIL · MCLELLAN NEIL R · MCLELLAN NEIL ROBERT
78 granted patents·21 pending applications·5,595 citations·filing 1986–2015
99Inventor score
Top patents by PatentIndex Score
99 records- 0199US7372151B1Ball grid array package and process for manufacturing sameASAT LTD·Filed 2003·Granted May 13, 2008·461 cites·8 claims
- 0298US6995460B1Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2005·Granted Feb 7, 2006·119 cites·19 claims
- 0398US6946324B1Process for fabricating a leadless plastic chip carrierASAT LTD·Filed 2003·Granted Sep 20, 2005·182 cites·10 claims
- 0498US6635957B2Leadless plastic chip carrier with etch back pad singulation and die attach pad arrayASAT LTD·Filed 2001·Granted Oct 21, 2003·199 cites·13 claims
- 0598US6498099B1Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 1999·Granted Dec 24, 2002·519 cites·12 claims
- 0698US6242281B1Saw-singulated leadless plastic chip carrierASAT LTD·Filed 1999·Granted Jun 5, 2001·413 cites·12 claims
- 0798US6229200B1Saw-singulated leadless plastic chip carrierASAT LTD·Filed 1998·Granted May 8, 2001·556 cites·9 claims
- 0897US7358119B2Thin array plastic package without die attach pad and process for fabricating the sameASAT LTD·Filed 2005·Granted Apr 15, 2008·78 cites·24 claims
- 0997US6933176B1Ball grid array package and process for manufacturing sameASAT LTD·Filed 2003·Granted Aug 23, 2005·121 cites·23 claims
- 1096US7342305B1Thermally enhanced cavity-down integrated circuit packageASAT LTD·Filed 2005·Granted Mar 11, 2008·64 cites·9 claims
- 1196US7247526B1Process for fabricating an integrated circuit packageASAT LTD·Filed 2005·Granted Jul 24, 2007·134 cites·14 claims
- 1296US7226811B1Process for fabricating a leadless plastic chip carrierASAT LTD·Filed 2005·Granted Jun 5, 2007·55 cites·3 claims
- 1396US6989294B1Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2003·Granted Jan 24, 2006·101 cites·8 claims
- 1496US6987032B1Ball grid array package and process for manufacturing sameASAT LTD·Filed 2003·Granted Jan 17, 2006·126 cites·29 claims
- 1596US6933594B2Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2001·Granted Aug 23, 2005·140 cites·12 claims
- 1696US6294100B1Exposed die leadless plastic chip carrierASAT LTD·Filed 1999·Granted Sep 25, 2001·349 cites·11 claims
- 1795US7271032B1Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2005·Granted Sep 18, 2007·43 cites·29 claims
- 1895US6585905B1Leadless plastic chip carrier with partial etch die attach padASAT LTD·Filed 2002·Granted Jul 1, 2003·226 cites·16 claims
- 1994US8647974B2Method of fabricating a semiconductor chip with supportive terminal padTOPACIO RODEN R·Filed 2011·Granted Feb 11, 2014·22 cites·24 claims
- 2094US7371610B1Process for fabricating an integrated circuit package with reduced mold warpingASAT LTD·Filed 2004·Granted May 13, 2008·79 cites·26 claims
- 2194US7315080B1Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreaderASAT LTD·Filed 2004·Granted Jan 1, 2008·76 cites·5 claims
- 2294US7091581B1Integrated circuit package and process for fabricating the sameASAT LTD·Filed 2004·Granted Aug 15, 2006·122 cites·9 claims
- 2394US6737755B1Ball grid array package with improved thermal characteristicsASAT LTD·Filed 2002·Granted May 18, 2004·109 cites·14 claims
- 2493US7411289B1Integrated circuit package with partially exposed contact pads and process for fabricating the sameASAT LTD·Filed 2004·Granted Aug 12, 2008·101 cites·14 claims
- 2593US5130783AFlexible film semiconductor packageTEXAS INSTRUMENTS INC·Filed 1991·Granted Jul 14, 1992·151 cites·13 claims
- 2692US6984785B1Thermally enhanced cavity-down integrated circuit packageASAT LTD·Filed 2003·Granted Jan 10, 2006·75 cites·9 claims
- 2792US6940154B2Integrated circuit package and method of manufacturing the integrated circuit packageASAT LTD·Filed 2002·Granted Sep 6, 2005·110 cites·99 claims
- 2891US7224048B1Flip chip ball grid array packageASAT LTD·Filed 2003·Granted May 29, 2007·65 cites·17 claims
- 2990US7232755B1Process for fabricating pad frame and integrated circuit packageASAT LTD·Filed 2005·Granted Jun 19, 2007·20 cites·21 claims
- 3090US6841859B1Premolded cavity IC packageASAT LTD·Filed 2004·Granted Jan 11, 2005·82 cites·2 claims
- 3189US6667191B1Chip scale integrated circuit packageASAT LTD·Filed 2002·Granted Dec 23, 2003·62 cites·20 claims
- 3289US6429048B1Metal foil laminated IC packageASAT LTD·Filed 2000·Granted Aug 6, 2002·78 cites·14 claims
- 3388US8120170B2Integrated package circuit with stiffenerMCLELLAN NEIL R·Filed 2008·Granted Feb 21, 2012·13 cites·16 claims
- 3488US6872661B1Leadless plastic chip carrier with etch back pad singulation and die attach pad arrayASAT LTD·Filed 2002·Granted Mar 29, 2005·53 cites·19 claims
- 3587US6790710B2Method of manufacturing an integrated circuit packageASAT LTD·Filed 2002·Granted Sep 14, 2004·56 cites·48 claims
- 3686US8847383B2Integrated circuit package strip with stiffenerMCLELLAN NEIL R·Filed 2012·Granted Sep 30, 2014·7 cites·11 claims
- 3784US8344505B2Wafer level packaging of semiconductor chipsATI TECHNOLOGIES ULC·Filed 2007·Granted Jan 1, 2013·13 cites·20 claims
- 3883US7595225B1Leadless plastic chip carrier with contact standoffFAN CHUN HO·Filed 2004·Granted Sep 29, 2009·67 cites·16 claims
- 3983US7270867B1Leadless plastic chip carrierASAT LTD·Filed 2004·Granted Sep 18, 2007·34 cites·11 claims
- 4082US8704353B2Thermal management of stacked semiconductor chips with electrically non-functional interconnectsSU MICHAEL·Filed 2012·Granted Apr 22, 2014·7 cites·24 claims
- 4182US7985621B2Method and apparatus for making semiconductor packagesATI TECHNOLOGIES ULC·Filed 2006·Granted Jul 26, 2011·8 cites·36 claims
- 4282US7799608B2Die stacking apparatus and methodADVANCED MICRO DEVICES INC·Filed 2007·Granted Sep 21, 2010·10 cites·17 claims
- 4381US9318457B2Methods of fabricating semiconductor chip solder structuresTOPACIO RODEN R·Filed 2015·Granted Apr 19, 2016·3 cites·20 claims
- 4481USD384336SPower cap coverDALLAS SEMICONDUCTOR·Filed 1996·Granted Sep 30, 1997·25 cites·1 claims
- 4580US7994044B2Semiconductor chip with contoured solder structure openingATI TECHNOLOGIES ULC·Filed 2009·Granted Aug 9, 2011·8 cites·20 claims
- 4678US8610262B1Ball grid array package with improved thermal characteristicsMCLELLAN NEIL·Filed 2005·Granted Dec 17, 2013·9 cites·11 claims
- 4776US8314474B2Under bump metallization for on-die capacitorMCLELLAN NEIL·Filed 2008·Granted Nov 20, 2012·8 cites·30 claims
- 4876US6821817B1Premolded cavity IC packageASAT LTD·Filed 2002·Granted Nov 23, 2004·25 cites·13 claims
- 4974US8445329B2Circuit board with oval micro viaLEUNG ANDREW K W·Filed 2009·Granted May 21, 2013·7 cites·19 claims
- 5074US8330270B1Integrated circuit package having a plurality of spaced apart pad portionsLIN GERALDINE TSUI YEE·Filed 2004·Granted Dec 11, 2012·22 cites·15 claims
Showing the top 50 of 99 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →