Inventor · disambiguated record
Jingwan Kim
Also filed as: KIM JINGWAN
17 granted patents·139 citations·filing 2008–2023
93Inventor score
Technology areasH10W
Top patents by PatentIndex Score
17 records- 0193US8343810B2Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layersSTATS CHIPPAC LTD·Filed 2010·Granted Jan 1, 2013·18 cites·30 claims
- 0293US8004093B2Integrated circuit package stacking systemSTATS CHIPPAC LTD·Filed 2008·Granted Aug 23, 2011·37 cites·18 claims
- 0392US8836114B2Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layersSTATS CHIPPAC LTD·Filed 2012·Granted Sep 16, 2014·15 cites·31 claims
- 0492US8003496B2Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the dieSTATS CHIPPAC LTD·Filed 2009·Granted Aug 23, 2011·22 cites·21 claims
- 0587US9401347B2Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSVSTATS CHIPPAC LTD·Filed 2015·Granted Jul 26, 2016·5 cites·24 claims
- 0686US8531012B2Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSVLEE SINJAE·Filed 2009·Granted Sep 10, 2013·13 cites·22 claims
- 0785US9379064B2Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the dieSTATS CHIPPAC LTD·Filed 2015·Granted Jun 28, 2016·4 cites·25 claims
- 0883US11776861B2Compartment shielding with metal frame and capSTATS CHIPPAC PTE LTD·Filed 2021·Granted Oct 3, 2023·1 cites·13 claims
- 0981US8932908B2Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor dieSTATS CHIPPAC LTD·Filed 2013·Granted Jan 13, 2015·5 cites·30 claims
- 1079US8432028B2Integrated circuit packaging system with package-on-package and method of manufacture thereofKIM JINGWAN·Filed 2011·Granted Apr 30, 2013·8 cites·20 claims
- 1174US9048209B2Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the dieOH JIHOON·Filed 2011·Granted Jun 2, 2015·4 cites·28 claims
- 1272US8937371B2Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSVSTATS CHIPPAC LTD·Filed 2013·Granted Jan 20, 2015·2 cites·24 claims
- 1368US12412792B2Compartment shielding with metal frame and capSTATS CHIPPAC PTE LTD·Filed 2023·Granted Sep 9, 2025·0 cites·24 claims
- 1464US8310038B2Integrated circuit packaging system with embedded conductive structure and method of manufacture thereofKIM JINGWAN·Filed 2011·Granted Nov 13, 2012·2 cites·20 claims
- 1564US8288202B2Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor dieLEE KYUWON·Filed 2010·Granted Oct 16, 2012·2 cites·20 claims
- 1655US8476135B2Integrated circuit packaging system with vertical interconnects and method of manufacture thereofKIM JINGWAN·Filed 2011·Granted Jul 2, 2013·1 cites·20 claims
- 1747US8502392B2Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor dieLEE KYUWON·Filed 2012·Granted Aug 6, 2013·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →