Inventor · disambiguated record
Der-Ling Hsia
Also filed as: HSIA DER-LING
4 granted patents·2 pending applications·8 citations·filing 2009–2016
64Inventor score
Top patents by PatentIndex Score
6 records- 0176US8278681B2Light-emitting diode package and wafer-level packaging process of light-emitting diodeLEE CHIA-EN·Filed 2009·Granted Oct 2, 2012·7 cites·8 claims
- 0261US9461213B2LED sub-mount and method for manufacturing light emitting device using the sub-mountLEXTAR ELECTRONICS CORP·Filed 2014·Granted Oct 4, 2016·1 cites·6 claims
- 0346US8445327B2Light-emitting diode package and wafer-level packaging process of light-emitting diodeLEE CHIA-EN·Filed 2012·Granted May 21, 2013·0 cites·14 claims
- 0446US8415683B2Light emitting diode chipLEE CHIA-EN·Filed 2009·Granted Apr 9, 2013·0 cites·24 claims
- 0544US2016380173A1LED Sub-Mount and Method for Manufacturing Light Emitting Device Using the Sub-MountLEXTAR ELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 0642US2015034959A1Patterned substrate and light emitting diode structure having the sameLEXTAR ELECTRONICS CORP·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →