LED Sub-Mount and Method for Manufacturing Light Emitting Device Using the Sub-Mount

Abstract

A light emitting device manufacturing method includes the following steps. A sub-mount, which has a plurality of electrical-conductive layers, is provided, and a surface between every adjacent two of the electrical-conductive layers has an adhesive-filling groove. An LED chip, which has a bottom substrate, is mounted on the sub-mount by a flip-chip way, and two electrodes of the LED chip are in contact with adjacent two of the electrical-conductive layers. Glue is filled along the adhesive-filling groove to be guided into a gap between the LED chip and the sub-mount.

What is claimed is: 
     
         1 . A light emitting device manufacturing method comprising:
 providing a sub-mount, which has a plurality of electrical-conductive layers, and a surface between every adjacent two of the electrical-conductive layers has an adhesive-filling groove;   mounting an LED chip, which has a bottom substrate, on the sub-mount by a flip-chip way, and two electrodes of the LED chip are in contact with adjacent two of the electrical-conductive layers; and   filling an glue along the adhesive-filling groove to be guided into a gap between the LED chip and the sub-mount.   
     
     
         2 . The light emitting device manufacturing method of  claim 1  further comprising a laser liftoff step to remove the bottom substrate of the LED chip to expose a surface of the LED chip. 
     
     
         3 . The light emitting device manufacturing method of  claim 2  further comprising a roughening treatment applied to the exposed surface of the LED chip. 
     
     
         4 . The light emitting device manufacturing method of  claim 1 , wherein the adhesive-filling groove has a depth ranging from 5 microns to 100 microns. 
     
     
         5 . The light emitting device manufacturing method of  claim 1 , wherein the adhesive-filling groove has a width ranging from 25 microns to 500 microns. 
     
     
         6 . The light emitting device manufacturing method of  claim 1  further comprising a eutectic bonding process to mount the LED chip on the sub-mount. 
     
     
         7 . The light emitting device manufacturing method of  claim 1 , wherein the adjacent two of the electrical-conductive layers are in direct contact with an outer side surface of the adhesive-filling groove and not in direct contact with an inner side surface of the adhesive-filling groove.