Inventor · disambiguated record
Sen-Kuei Hsu
Also filed as: HSU SEN-KUEI
41 granted patents·5 pending applications·91 citations·filing 2013–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD46
Top patents by PatentIndex Score
46 records- 0198US11942442B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 26, 2024·4 cites·20 claims
- 0298US11296067B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 5, 2022·4 cites·20 claims
- 0397US12266648B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·2 cites·20 claims
- 0497US11824054B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 21, 2023·2 cites·20 claims
- 0597US10490479B1Packaging of semiconductor device with antenna and heat spreaderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 26, 2019·16 cites·20 claims
- 0696US11444023B2Semiconductor device, package structure including a heat dissipation element having a conductive base and a plurality of antenna patterns and method of fabricating the semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·4 cites·20 claims
- 0795US12021024B2Semiconductor device including a semiconductor die and a plurality of antenna patternsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 25, 2024·2 cites·20 claims
- 0893US10840197B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 17, 2020·6 cites·20 claims
- 0993US10818588B2Semiconductor device, package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 27, 2020·7 cites·20 claims
- 1093US10818651B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 27, 2020·6 cites·20 claims
- 1192US11532576B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·3 cites·20 claims
- 1292US9406648B2Power supply arrangement for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 2, 2016·13 cites·20 claims
- 1391US2025343136A1Conductive Traces in Semiconductor Devices and Methods of Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1490US12051666B2Package structure and manufacturing method of package structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 30, 2024·1 cites·20 claims
- 1589US11355466B2Package structure and manufacturing method of package structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 7, 2022·2 cites·20 claims
- 1689US2025343178A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1788US11322453B2Semiconductor package having channels formed between through-insulator-viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 3, 2022·5 cites·20 claims
- 1886US12451426B2Conductive traces in semiconductor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 21, 2025·0 cites·19 claims
- 1985US12424571B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 2085US12362275B2Method of fabricating package structure including a plurality of antenna patternsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 2185US10872842B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 22, 2020·4 cites·20 claims
- 2280US10748831B2Semiconductor packages having thermal through vias (TTV)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 18, 2020·2 cites·20 claims
- 2380US9653406B2Conductive traces in semiconductor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 16, 2017·2 cites·19 claims
- 2478US11852672B2Test circuit and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 2578US9899982B2On-chip electromagnetic bandgap (EBG) structure for noise suppressionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 20, 2018·3 cites·20 claims
- 2678US2024339427A1Manufacturing method of package structure and package structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2777US2024304561A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2876US12014992B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 18, 2024·0 cites·20 claims
- 2976US9891266B2Test circuit and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 13, 2018·2 cites·20 claims
- 3074US11894299B2Conductive traces in semiconductor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·0 cites·20 claims
- 3174US10937734B2Conductive traces in semiconductor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 2, 2021·1 cites·20 claims
- 3271US11467203B2Test circuit and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·20 claims
- 3370US11373922B2Semiconductor packages having thermal through vias (TTV)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·0 cites·20 claims
- 3469US2022285241A1Method of forming semiconductor packages having thermal through vias (ttv)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3567US11508666B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 3666US10718790B2Devices for high-density probing techniques and method of implementing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 21, 2020·0 cites·19 claims
- 3765US11631993B2Wireless charging devices having wireless charging coils and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 18, 2023·0 cites·20 claims
- 3861US11249112B2Devices for high-density probing techniques and method of implementing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 3961US10867882B2Semiconductor package, semiconductor device and method for packaging semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 4059US10274518B2Devices for high-density probing techniques and method of implementing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·0 cites·20 claims
- 4156US10725090B2Test circuit and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 28, 2020·0 cites·20 claims
- 4255US10157859B2Semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 18, 2018·0 cites·20 claims
- 4354US9875972B1Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 23, 2018·0 cites·20 claims
- 4454US9354254B2Test-yield improvement devices for high-density probing techniques and method of implementing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 31, 2016·0 cites·20 claims
- 4550US10720788B2Wireless charging devices having wireless charging coils and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 21, 2020·0 cites·20 claims
- 4645US10256203B2Semiconductor device and semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 9, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →