Inventor · disambiguated record
Yisu Park
Also filed as: PARK YISU
6 granted patents·2 pending applications·28 citations·filing 2012–2025
79Inventor score
Top patents by PatentIndex Score
8 records- 0190US10700011B2Semiconductor device and method of forming an integrated SIP module with embedded inductor or packageSTATS CHIPPAC PTE LTD·Filed 2017·Granted Jun 30, 2020·7 cites·22 claims
- 0279US8723310B2Integrated circuit packaging system having warpage prevention structuresPARK YISU·Filed 2012·Granted May 13, 2014·8 cites·10 claims
- 0377US9406579B2Semiconductor device and method of controlling warpage in semiconductor packageCHOI DAESIK·Filed 2012·Granted Aug 2, 2016·5 cites·27 claims
- 0476US9390945B2Semiconductor device and method of depositing underfill material with uniform flow rateLEE KYUNGHOON·Filed 2012·Granted Jul 12, 2016·4 cites·26 claims
- 0574US8703535B2Integrated circuit packaging system with warpage preventing mechanism and method of manufacture thereofKIM MINJUNG·Filed 2012·Granted Apr 22, 2014·4 cites·18 claims
- 0666US2025351263A1Printed circuit board and electronic device comprising sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0765US11367690B2Semiconductor device and method of forming an integrated SiP module with embedded inductor or packageSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jun 21, 2022·0 cites·23 claims
- 0839US2013328220A1Integrated circuit packaging system with film assist and method of manufacture thereofLEE KYUNGHOON·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →