Inventor · disambiguated record
Nicholas A. Polomoff
Also filed as: POLOMOFF NICHOLAS · POLOMOFF NICHOLAS A · POLOMOFF NICHOLAS ALEXANDER
30 granted patents·53 pending applications·68 citations·filing 2014–2024
95Inventor score
Files withIBM52GLOBALFOUNDRIES US INC18GLOBALFOUNDRIES INC10SUSS MICROTEC PHOTONIC SYSTEMS INC2Avera Semiconductor LLC1
Top patents by PatentIndex Score
83 records- 0197US11650381B1PIC die and package with cover for multiple level and multiple depth connections of fibers to on-chip optical componentsGLOBALFOUNDRIES US INC·Filed 2022·Granted May 16, 2023·10 cites·20 claims
- 0297US11215661B2Cascaded sensing circuits for detecting and monitoring cracks in an integrated circuitGLOBALFOUNDRIES US INC·Filed 2020·Granted Jan 4, 2022·5 cites·18 claims
- 0396US11105846B1Crack detecting and monitoring system for an integrated circuitGLOBALFOUNDRIES US INC·Filed 2020·Granted Aug 31, 2021·12 cites·20 claims
- 0495US12130470B2PIC die and package with multiple level and multiple depth connections of fibers to on-chip optical componentsGLOBALFOUNDRIES US INC·Filed 2021·Granted Oct 29, 2024·3 cites·17 claims
- 0595US11693048B2Cascaded sensing circuits for detecting and monitoring cracks in an integrated circuitGLOBALFOUNDRIES US INC·Filed 2021·Granted Jul 4, 2023·2 cites·20 claims
- 0694US11740418B2Barrier structure with passage for waveguide in photonic integrated circuitGLOBALFOUNDRIES US INC·Filed 2021·Granted Aug 29, 2023·3 cites·20 claims
- 0793US11804452B2Pic structure having barrier surrounding opening for optical element to prevent stress damageGLOBALFOUNDRIES US INC·Filed 2021·Granted Oct 31, 2023·8 cites·20 claims
- 0890US11543606B2Photonics chips with an edge coupler and a continuous crackstopGLOBALFOUNDRIES US INC·Filed 2021·Granted Jan 3, 2023·2 cites·20 claims
- 0989US10546822B2Seal ring structure of integrated circuit and method of forming sameGLOBALFOUNDRIES INC·Filed 2017·Granted Jan 28, 2020·6 cites·19 claims
- 1087US11719895B1Spot-size converters with angled facetsGLOBALFOUNDRIES US INC·Filed 2022·Granted Aug 8, 2023·1 cites·20 claims
- 1182US11828983B2Photonics chips including cavities with non-right-angle internal cornersGLOBALFOUNDRIES US INC·Filed 2022·Granted Nov 28, 2023·1 cites·20 claims
- 1281US10770407B2IC structure with interdigitated conductive elements between metal guard structuresGLOBALFOUNDRIES INC·Filed 2019·Granted Sep 8, 2020·3 cites·19 claims
- 1380US10770412B2Guard ring for photonic integrated circuit dieGLOBALFOUNDRIES INC·Filed 2018·Granted Sep 8, 2020·3 cites·16 claims
- 1480US10109600B1Crackstop structuresGLOBALFOUNDRIES INC·Filed 2017·Granted Oct 23, 2018·2 cites·20 claims
- 1577US2024402421A1Pic die and package with multiple level and multiple depth connections of fibers to on-chip optical componentsGLOBALFOUNDRIES US INC·Filed 2024·Application pending·0 cites
- 1672US10714411B2Interconnected integrated circuit (IC) chip structure and packaging and method of forming sameGLOBALFOUNDRIES INC·Filed 2018·Granted Jul 14, 2020·2 cites·19 claims
- 1770US10068859B1Crack trapping in semiconductor device structuresGLOBALFOUNDRIES INC·Filed 2017·Granted Sep 4, 2018·2 cites·16 claims
- 1870US2024030160A1Crackstop with embedded passive radio frequency noise suppressor and methodGLOBALFOUNDRIES US INC·Filed 2023·Application pending·0 cites
- 1969US11569180B2Corner structures for an optical fiber groove and manufacturing methods thereofGLOBALFOUNDRIES US INC·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 2067US10438902B2Arc-resistant crackstopGLOBALFOUNDRIES INC·Filed 2017·Granted Oct 8, 2019·1 cites·17 claims
- 2167US10153232B2Crack stop with overlapping viasGLOBALFOUNDRIES INC·Filed 2017·Granted Dec 11, 2018·1 cites·17 claims
- 2267US10090258B1Crack-stop structure for an IC product and methods of making such a crack-stop structureGLOBALFOUNDRIES INC·Filed 2017·Granted Oct 2, 2018·1 cites·16 claims
- 2363US11855005B2Crackstop with embedded passive radio frequency noise suppressor and methodGLOBALFOUNDRIES US INC·Filed 2021·Granted Dec 26, 2023·0 cites·9 claims
- 2462US2025357328A1Antifuse structureIBM·Filed 2024·Application pending·0 cites
- 2562US2025357330A1Delta metal fuse structureIBM·Filed 2024·Application pending·0 cites
- 2661US12204144B2Bragg reflector for photonic chip security structureGLOBALFOUNDRIES US INC·Filed 2021·Granted Jan 21, 2025·0 cites·20 claims
- 2761US11145606B1Corner structures for an optical fiber grooveGLOBALFOUNDRIES US INC·Filed 2020·Granted Oct 12, 2021·0 cites·16 claims
- 2861US2025309055A1Testing structures for multi-level testing of semiconductor devicesIBM·Filed 2024·Application pending·0 cites
- 2960US2025385204A1Structures and materials for reducing in-plane stresses and voids - creating an optimized hybrid bonding interfaceIBM·Filed 2024·Application pending·0 cites
- 3060US2025391792A1Hybrid bonded capacitor device structureIBM·Filed 2024·Application pending·0 cites
- 3159US11815717B2Photonic chip security structureGLOBALFOUNDRIES US INC·Filed 2021·Granted Nov 14, 2023·0 cites·18 claims
- 3259US2025259926A1Hybrid bond features in programmable circuitsIBM·Filed 2024·Application pending·0 cites
- 3359US2025259927A1Fusible d-fuse hybrid bond structureIBM·Filed 2024·Application pending·0 cites
- 3459US2025112121A1Active prime region with conductive bypassIBM·Filed 2023·Application pending·0 cites
- 3559US2025201638A1Structure for monitoring hybrid bonds in a semiconductor chip packageIBM·Filed 2023·Application pending·0 cites
- 3658US2025048677A1Backside power rail to backside contact connectionIBM·Filed 2023·Application pending·0 cites
- 3758US2025031448A1Backside Contact With Self-Aligned Gate IsolationIBM·Filed 2023·Application pending·0 cites
- 3858US2025006664A1Three dimensional mechanically bolting staple fillIBM·Filed 2023·Application pending·0 cites
- 3958US2025006663A1Double-sided integrated circuit with electrostatic guard ringIBM·Filed 2023·Application pending·0 cites
- 4058US2025379166A1Repair structure for bonded semiconductor deviceIBM·Filed 2024·Application pending·0 cites
- 4158US2025006629A1Double-sided integrated circuit with damage sensorIBM·Filed 2023·Application pending·0 cites
- 4258US2025329671A1Resistance temperature detector at hybrid bonding interfaceIBM·Filed 2024·Application pending·0 cites
- 4358US2025006590A1Double-sided integrated circuit with stabilizing cageIBM·Filed 2023·Application pending·0 cites
- 4458US2025149465A1Crackstop barrier architecture for hybrid bonded semiconductor packagesIBM·Filed 2023·Application pending·0 cites
- 4557US11774689B2Photonics chips and semiconductor products having angled optical fibersGLOBALFOUNDRIES US INC·Filed 2021·Granted Oct 3, 2023·0 cites·17 claims
- 4657US2025380454A1Parasitic capacitence reduction in stacked transistorIBM·Filed 2024·Application pending·0 cites
- 4757US2025349705A1Beol trench and via structureIBM·Filed 2024·Application pending·0 cites
- 4857US2024429178A1Monolith structure for bspdn semiconductor devicesIBM·Filed 2023·Application pending·0 cites
- 4957US2025006658A1Three Dimensional Crackstop Interweave Architectural Design Using Supervia.IBM·Filed 2023·Application pending·0 cites
- 5056US2025201775A1High capacitance hybrid bonded capacitor deviceIBM·Filed 2023·Application pending·0 cites
Showing the top 50 of 83 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →