Inventor · disambiguated record
Masaru Nishino
Also filed as: NISHINO MASARU
17 granted patents·7 pending applications·171 citations·filing 1997–2024
93Inventor score
Files withTOKYO ELECTRON LTD17NEC CORP2TEL MFG AND ENGINEERING OF AMERICA INC2HONDA MASANOBU1LEE YAO-SHENG1
Top patents by PatentIndex Score
24 records- 0194US8361275B2Etching apparatusTOKYO ELECTRON LTD·Filed 2012·Granted Jan 29, 2013·14 cites·12 claims
- 0293US8790489B2Substrate processing apparatus and substrate processing methodHONDA MASANOBU·Filed 2011·Granted Jul 29, 2014·17 cites·7 claims
- 0392US7674393B2Etching method and apparatusTOKYO ELECTRON LTD·Filed 2006·Granted Mar 9, 2010·15 cites·10 claims
- 0490US7279427B2Damage-free ashing process and system for post low-k etchTOKYO ELECTRON LTD·Filed 2005·Granted Oct 9, 2007·18 cites·12 claims
- 0587US11694872B2Pattern enhancement using a gas cluster ion beamTEL MFG AND ENGINEERING OF AMERICA INC·Filed 2022·Granted Jul 4, 2023·1 cites·22 claims
- 0687US9305817B2Method for purging a substrate containerTOKYO ELECTRON LTD·Filed 2013·Granted Apr 5, 2016·13 cites·11 claims
- 0787US7637269B1Low damage method for ashing a substrate using CO2/CO-based processTOKYO ELECTRON LTD·Filed 2009·Granted Dec 29, 2009·17 cites·19 claims
- 0886US8986493B2Etching apparatusTOKYO ELECTRON LTD·Filed 2012·Granted Mar 24, 2015·5 cites·10 claims
- 0984US8896210B2Plasma processing apparatus and methodTOKYO ELECTRON LTD·Filed 2012·Granted Nov 25, 2014·10 cites·21 claims
- 1082US8252192B2Method of pattern etching a dielectric film while removing a mask layerLEE YAO-SHENG·Filed 2009·Granted Aug 28, 2012·9 cites·20 claims
- 1169US7998872B2Method for etching a silicon-containing ARC layer to reduce roughness and CDTOKYO ELECTRON LTD·Filed 2008·Granted Aug 16, 2011·3 cites·21 claims
- 1268US11450506B2Pattern enhancement using a gas cluster ion beamTEL MFG AND ENGINEERING OF AMERICA INC·Filed 2020·Granted Sep 20, 2022·0 cites·22 claims
- 1368US6594046B1Level-flattening circuit for WDM optical signalsNEC CORP·Filed 1999·Granted Jul 15, 2003·33 cites·3 claims
- 1454US5963685ACross-connection of wavelength-division-multiplexed high speed optical channelsNEC CORP·Filed 1997·Granted Oct 5, 1999·16 cites·4 claims
- 1553US9653317B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2014·Granted May 16, 2017·0 cites·5 claims
- 1653US2025216336A1Fault detection and classification (fdc) for endpoint detection (epd) by reflectometryTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1751US2010116786A1Etching method and apparatusTOKYO ELECTRON LTD·Filed 2010·Application pending·0 cites
- 1851US2010116787A1Etching method and apparatusTOKYO ELECTRON LTD·Filed 2010·Application pending·0 cites
- 1948US2010216310A1Process for etching anti-reflective coating to improve roughness, selectivity and CD shrinkTOKYO ELECTRON LTD·Filed 2009·Application pending·0 cites
- 2048US2017221684A1Plasma processing methodTOKYO ELECTRON LTD·Filed 2017·Application pending·0 cites
- 2144US2009246713A1Oxygen-containing plasma flash process for reduced micro-loading effect and cd biasTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 2243US2007111529A1Plasma etching methodTOKYO ELECTRON LTD·Filed 2006·Application pending·0 cites
- 2340US8190023B2Optical communication device, optical communication system, optical output control method and programNISHINO MASARU·Filed 2009·Granted May 29, 2012·0 cites·14 claims
- 2433US6986851B2Dry developing methodTOKYO ELECTRON LTD·Filed 2002·Granted Jan 17, 2006·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →