Inventor · disambiguated record
David R. Hembree
Also filed as: HEMBREE DAVID · HEMBREE DAVID R · HEMBREE DAVID RIES
364 granted patents·24 pending applications·19,291 citations·filing 1989–2025
99Inventor score
Files withMICRON TECHNOLOGY INC350HEMBREE DAVID R6AKRAM SALMAN5APTINA IMAGING CORP4FARNWORTH WARREN M3
Top patents by PatentIndex Score
388 records- 0199US8193646B2Semiconductor component having through wire interconnect (TWI) with compressed wireWOOD ALAN G·Filed 2010·Granted Jun 5, 2012·73 cites·4 claims
- 0299US7919846B2Stacked semiconductor component having through wire interconnectMICRON TECHNOLOGY INC·Filed 2010·Granted Apr 5, 2011·152 cites·17 claims
- 0399US7757385B2System for fabricating semiconductor components with through wire interconnectsMICRON TECHNOLOGY INC·Filed 2007·Granted Jul 20, 2010·131 cites·12 claims
- 0499US7728443B2Semiconductor components with through wire interconnectsMICRON TECHNOLOGY INC·Filed 2007·Granted Jun 1, 2010·127 cites·18 claims
- 0599US7682962B2Method for fabricating stacked semiconductor components with through wire interconnectsMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 23, 2010·133 cites·26 claims
- 0699US7659612B2Semiconductor components having encapsulated through wire interconnects (TWI)MICRON TECHNOLOGY INC·Filed 2006·Granted Feb 9, 2010·75 cites·47 claims
- 0799US7498675B2Semiconductor component having plate, stacked dice and conductive viasMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 3, 2009·292 cites·20 claims
- 0899US7393770B2Backside method for fabricating semiconductor components with conductive interconnectsMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 1, 2008·130 cites·23 claims
- 0999US7371676B2Method for fabricating semiconductor components with through wire interconnectsMICRON TECHNOLOGY INC·Filed 2005·Granted May 13, 2008·171 cites·32 claims
- 1099US7307348B2Semiconductor components having through wire interconnects (TWI)MICRON TECHNOLOGY INC·Filed 2005·Granted Dec 11, 2007·91 cites·56 claims
- 1199US6903443B2Semiconductor component and interconnect having conductive members and contacts on opposing sidesMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 7, 2005·246 cites·12 claims
- 1299US6841883B1Multi-dice chip scale semiconductor components and wafer level methods of fabricationMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 11, 2005·659 cites·71 claims
- 1399US6620731B1Method for fabricating semiconductor components and interconnects with contacts on opposing sidesMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 16, 2003·293 cites·31 claims
- 1499US6451709B1Methodology of removing misplaced encapsulant for attachment of heat sinks in a chip on board packageMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 17, 2002·152 cites·43 claims
- 1599US6359456B1Probe card and test system for semiconductor wafersMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 19, 2002·149 cites·25 claims
- 1699US6181144B1Semiconductor probe card having resistance measuring circuitry and method fabricationMICRON TECHNOLOGY INC·Filed 1998·Granted Jan 30, 2001·308 cites·20 claims
- 1799US6124634AMicromachined chip scale packageMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 26, 2000·328 cites·30 claims
- 1899US6072236AMicromachined chip scale packageMICRON TECHNOLOGY INC·Filed 1996·Granted Jun 6, 2000·520 cites·49 claims
- 1999US6060891AProbe card for semiconductor wafers and method and system for testing wafersMICRON TECHNOLOGY INC·Filed 1997·Granted May 9, 2000·218 cites·21 claims
- 2099US6025728ASemiconductor package with wire bond protective memberMICRON TECHNOLOGY INC·Filed 1997·Granted Feb 15, 2000·230 cites·24 claims
- 2199US5869974AMicromachined probe card having compliant contact members for testing semiconductor wafersMICRON TECHNOLOGY INC·Filed 1996·Granted Feb 9, 1999·259 cites·27 claims
- 2298US7833832B2Method of fabricating semiconductor components with through interconnectsMICRON TECHNOLOGY INC·Filed 2009·Granted Nov 16, 2010·56 cites·59 claims
- 2398US7683458B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 23, 2010·54 cites·17 claims
- 2498US6578458B1Method for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 17, 2003·106 cites·24 claims
- 2598US6300782B1System for testing semiconductor components having flexible interconnectMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 9, 2001·111 cites·16 claims
- 2698US6267650B1Apparatus and methods for substantial planarization of solder bumpsMICRON TECHNOLOGY INC·Filed 1999·Granted Jul 31, 2001·160 cites·12 claims
- 2798US6263566B1Flexible semiconductor interconnect fabricated by backslide thinningMICRON TECHNOLOGY INC·Filed 1999·Granted Jul 24, 2001·141 cites·17 claims
- 2898US6208156B1Test carrier for packaging semiconductor components having contact balls and calibration carrier for calibrating semiconductor test systemsMICRON TECHNOLOGY INC·Filed 1998·Granted Mar 27, 2001·137 cites·28 claims
- 2998US6094058ATemporary semiconductor package having dense array external contactsMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 25, 2000·173 cites·14 claims
- 3098US6078186AForce applying probe card and test system for semiconductor wafersMICRON TECHNOLOGY INC·Filed 1997·Granted Jun 20, 2000·197 cites·44 claims
- 3198US6018249ATest system with mechanical alignment for semiconductor chip scale packages and diceMICRON TECHNOLGOY INC·Filed 1997·Granted Jan 25, 2000·268 cites·18 claims
- 3298USD402638STemporary package for semiconductor diceMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 15, 1998·99 cites·1 claims
- 3398US5815000AMethod for testing semiconductor dice with conventionally sized temporary packagesMICRON TECHNOLOGY INC·Filed 1995·Granted Sep 29, 1998·271 cites·13 claims
- 3498USD394844STemporary package for semiconductor diceMICRON TECHNOLOGY INC·Filed 1997·Granted Jun 2, 1998·101 cites·1 claims
- 3598US5541525ACarrier for testing an unpackaged semiconductor dieMICRON TECHNOLOGY INC·Filed 1994·Granted Jul 30, 1996·276 cites·18 claims
- 3697US10461059B2Stacked semiconductor die assemblies with improved thermal performance and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Oct 29, 2019·22 cites·20 claims
- 3797US7951702B2Methods for fabricating semiconductor components with conductive interconnects having planar surfacesMICRON TECHNOLOGY INC·Filed 2010·Granted May 31, 2011·24 cites·19 claims
- 3897US7579267B2Methods and systems for fabricating semiconductor components with through wire interconnects (TWI)MICRON TECHNOLOGY INC·Filed 2007·Granted Aug 25, 2009·33 cites·59 claims
- 3997US7531453B2Microelectronic devices and methods for forming interconnects in microelectronic devicesMICRON TECHNOLOGY INC·Filed 2008·Granted May 12, 2009·45 cites·19 claims
- 4097US7300857B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2004·Granted Nov 27, 2007·166 cites·32 claims
- 4197US6841868B2Memory modules including capacity for additional memoryMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 11, 2005·83 cites·14 claims
- 4297US6774651B1Method for aligning and connecting semiconductor components to substratesMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 10, 2004·99 cites·66 claims
- 4397US6696669B2Circuit and method for heating an adhesive to package or rework a semiconductor dieMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 24, 2004·126 cites·16 claims
- 4497US6589594B1Method for filling a wafer through-via with a conductive materialMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 8, 2003·102 cites·28 claims
- 4597US6329637B1Method and process of contract to a heat softened solder ball arrayMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 11, 2001·79 cites·59 claims
- 4697US6242932B1Interposer for semiconductor components having contact ballsMICRON TECHNOLOGY INC·Filed 1999·Granted Jun 5, 2001·233 cites·26 claims
- 4797US6242931B1Flexible semiconductor interconnect fabricated by backside thinningMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 5, 2001·89 cites·14 claims
- 4897US6016060AMethod, apparatus and system for testing bumped semiconductor componentsMICRON TECHNOLOGY INC·Filed 1997·Granted Jan 18, 2000·132 cites·25 claims
- 4997US5952840AApparatus for testing semiconductor wafersMICRON TECHNOLOGY INC·Filed 1996·Granted Sep 14, 1999·128 cites·21 claims
- 5097US5938956ACircuit and method for heating an adhesive to package or rework a semiconductor dieMICRON TECHNOLOGY INC·Filed 1996·Granted Aug 17, 1999·229 cites·39 claims
Showing the top 50 of 388 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when David R. Hembree files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →