Inventor · disambiguated record
Takuji Ide
Also filed as: IDE TAKUJI
7 granted patents·1 pending application·41 citations·filing 2001–2017
84Inventor score
Technology areasH10W
Files withRENESAS ELECTRONICS CORP3HITACHI LTD2HITACHI HOKKAI SEMICONDUCTOR1RENESAS TECH CORP1YASUMURA BUNJI1
Top patents by PatentIndex Score
8 records- 0186US8946705B2Semiconductor deviceYASUMURA BUNJI·Filed 2010·Granted Feb 3, 2015·10 cites·23 claims
- 0278US9824944B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Nov 21, 2017·2 cites·21 claims
- 0361US7199469B2Semiconductor device having stacked semiconductor chips sealed with a resin seal memberHITACHI HOKKAI SEMICONDUCTOR·Filed 2001·Granted Apr 3, 2007·12 cites·4 claims
- 0456US10163740B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 25, 2018·0 cites·9 claims
- 0555US6420783B2Semiconductor device and a method of manufacturing the sameHITACHI LTD·Filed 2001·Granted Jul 16, 2002·7 cites·10 claims
- 0653US6879037B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Apr 12, 2005·6 cites·5 claims
- 0750US2015137125A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 0848US6727114B2Semiconductor device and a method of manufacturing the sameHITACHI LTD·Filed 2001·Granted Apr 27, 2004·4 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →